AI Data Center High-Speed Interconnect Architect (AI)

Location: Fremont, United States

Company

hirify.global develops high-speed interconnect technologies for AI servers, rack configurations, compute platforms, and high-performance computing infrastructure.

What you will do

• Architect and optimize high-speed backplanes, co-packaged copper, OSFP and OSFP-X solutions, cables, and onboard connectors for AI/ML and HPC platforms.
• Balance performance, signal integrity, power consumption, cost efficiency, scalability, and manufacturing feasibility.
• Assess and select evolving interconnect technologies, including NVLINK, UALINK, PCIe, and CXL.
• Collaborate with signal integrity, power integrity, hardware, system, packaging, and software teams to integrate solutions into AI server and rack architectures.
• Represent the organization in OCP, PCI-SIG, UALINK, IEEE, and CXL Consortium standards activities.
• Engage with hyperscalers, OEMs, and technology partners while preparing technical specifications, architecture documents, and product roadmap contributions.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related discipline.
• At least 10 years of professional experience in high-speed interconnect architecture, signal integrity, or system design for compute, networking, or AI platforms.
• Extensive expertise in high-speed protocols and technologies, including NVLINK, UALINK, PCIe, CXL, Ethernet, InfiniBand, OSFP, and OSFP-X.
• Comprehensive knowledge of signal integrity, power integrity, PCB, package, and system design, as well as relevant simulation tools.
• Experience participating in or influencing industry standards development.
• Strong communication and cross-functional leadership skills.

Nice to have

• Familiarity with hardware/software co-design and performance analysis for AI/HPC workloads.