Staff Package Design Engineer (Power SiP/Module)

Location: Zhubei, Taiwan; onsite position with no remote work available

Company

hirify.global is a global semiconductor company developing embedded solutions for automotive, industrial, infrastructure, and IoT markets.

What you will do

• Design and develop package and interconnect methods for power SiP/modules, wafer-level, flip-chip, multi-chip module, and power device packaging.
• Develop and qualify package technologies, materials, processes, and assembly partners for consumer, industrial, and automotive power applications.
• Run design of experiments with OSATs and contract manufacturers to optimize processes and establish process specifications.
• Resolve process integration issues, perform critical process window checks, and establish production controls.
• Support production transition and ramp-up monitoring while resolving early production issues to maintain product quality.
• Contribute to packaging roadmaps, technical innovation, customer issue resolution, and package design rules.

Requirements

• Doctorate, master’s, or bachelor’s degree in physics, chemistry, mechanical, electrical, or materials engineering.
• 6–12 years of relevant package development experience, with emphasis on power SiP/module, wafer-level, and flip-chip packaging.
• Strong knowledge of power SiP/module packaging, wafer processing, flip-chip interconnects, assembly processes, and qualification methods.
• Experience with SPC and statistical analysis software.
• Strong analytical, presentation, interpersonal, and communication skills.

Nice to have

• Knowledge of wire bonding and multi-chip module technologies.

Culture & Benefits

• Regular permanent employment with a competitive benefits package.
• Work within a global team of more than 21,000 employees across over 30 countries.
• Collaborative culture based on being Transparent, Agile, Global, Innovative, and Entrepreneurial.
• Commitment to diversity, inclusion, and equal employment opportunity.