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4 часа назад

Micro Assembly Process Engineer

147 248 - 152 248$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Micro Assembly Process Engineer (Semiconductor Manufacturing): Leading troubleshooting, repair, maintenance, and continuous improvement of complex probe cards and micro-assembly processes with an accent on metrology, process quality, equipment performance, and new product introduction. Focus on managing JMP analysis and DOEs, transferring processes from development to low- and high-volume manufacturing, and upgrading automated assembly equipment to improve throughput and capacity.

Location: Onsite at 7005 Southfront Road, Livermore, CA 94551, United States

Salary: $147,248–$152,248 per year

Company

hirify.global develops and manufactures probe cards and related semiconductor test and assembly technologies.

What you will do

  • Lead troubleshooting, repair, and maintenance of complex probe cards and precision electromechanical sub-assemblies.
  • Identify and implement manufacturing improvements, new production methods, and continuous process improvement initiatives.
  • Support first-article probe cards through substrate alignment, sub-assembly, tooling introduction, setup, verification, metrology, and rework.
  • Modify automated assembly processes, alignment measurement parameters, and procedures for new products.
  • Manage and participate in assembly equipment hardware and software upgrades, capacity increases, and CapEx projects.
  • Coach and train technicians and certify operator core trainers across CWW shifts.

Requirements

  • Bachelor’s degree or foreign equivalent in Manufacturing Engineering, Mechanical Engineering, or a related field.
  • At least five years of progressive experience as a Field Service/Application Engineer, Quality Control Engineer, or in a related occupation.
  • At least one year of experience managing JMP analysis models, yield analysis, quality controls, and DOEs using statistical software.
  • At least one year of experience troubleshooting probe cards, repairing precision electromechanical assemblies, and applying root cause analysis.
  • At least one year of experience with NPI, equipment assessment and customization, micro-assembly process improvement, and process transfer from development to LVM and HVM.
  • At least one year of experience using microscopes, micromanipulators, optical measurement systems, calipers, micrometers, and dial indicators for dimensional inspection and alignment verification.

Culture & Benefits

  • Full-time employment in a manufacturing and production environment.
  • Opportunity to develop technician teamwork, leadership, and technical capabilities through coaching and training.
  • Work focused on improving production quality, throughput, process capability, and manufacturing capacity.
  • Equal employment opportunity in accordance with applicable national, state, and local laws.

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