Technical Leader (3D-IC Thermal-Mechanical Reliability)

Location: Watertown, Massachusetts, United States — on-site

Company

hirify.global is a technology startup developing ultra-fast GPU simulation technology and Physics AI Foundation Models for engineering applications including aerospace, automotive, wind energy, quantum computing, and advanced semiconductor packaging.

What you will do

• Own the technical roadmap for thermal-mechanical reliability and define how Physics AI accelerates FEA and multiphysics workflows.
• Design end-to-end simulation workflows for 3D-IC and chiplet challenges, including TSV stress, micro-bump reliability, and package warpage.
• Partner with semiconductor companies to demonstrate faster iterative design and reliability analysis.
• Influence GPU-accelerated solver development for nonlinear materials and multiscale meshes.
• Recruit, mentor, and lead engineers specializing in computational mechanics and AI-driven physics.

Requirements

• PhD in Mechanical Engineering, Materials Science, Physics, or a related field, with deep specialization in computational multiphysics.
• Recognized expertise in 3D-IC reliability, including warpage, interfacial delamination, and thermal-mechanical coupling in heterogeneous integration.
• Strong understanding of GPU acceleration and machine learning in scientific computing.
• 10+ years of experience in the semiconductor or microelectronics industry.
• Experience leading technical projects that directly affected product reliability or time-to-market.

Culture & Benefits

• Competitive compensation with equity in a fast-growing startup.
• Medical, dental, and vision insurance.
• 401(k) contribution.
• Gym allowance.
• Collaborative environment with thoughtful and technically focused coworkers.