Thermal Engineering Leader (Physics AI)

Location: Taiwan; remote role. Moderate travel within Asia and infrequent intercontinental travel to collaborate with the US team may be required.

Company

hirify.global develops Physics AI software that helps hardware designers and physics simulation engineers analyze and optimize complex hardware systems, including next-generation semiconductor designs.

What you will do

• Build, lead, and scale a high-performing team of thermal engineers across Asia.
• Partner with Sales to lead technical discussions, scope proof-of-concept evaluations, and deliver product demonstrations.
• Guide customer engineering teams through simulation setup, complex test cases, result interpretation, onboarding, deployment, and troubleshooting.
• Evaluate thermal risk, component reliability, power density, cooling efficiency, fluid flow, and steady-state and transient thermal behavior.
• Translate customer pain points and workflow bottlenecks into actionable product and engineering feedback.
• Represent hirify.global at semiconductor conferences and industry events while communicating competitive technologies and market trends.

Requirements

• Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
• Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, or Simcenter STAR-CCM+, with 15+ years of hands-on thermal management or cooling experience.
• Deep familiarity with semiconductor electronics packaging, advanced 2.5D/3D IC packaging, or foundry ecosystems.
• Customer-facing experience with strong engineering relationship-building and communication skills.
• Practical Python or C++ experience for workflow automation or simulation-data parsing.
• Prior managerial or technical leadership experience scaling, mentoring, and guiding engineering teams.

Nice to have

• Experience with structural mechanical simulations, FEA/stress, or electrical signal integrity and power integrity workflows.
• Experience commercializing EDA or CAE simulation tools for semiconductor and electronics enterprises.
• Technical pre-sales, application engineering, field applications engineering, or strategic technical sales experience.
• Experience with AI-assisted design or simulation tools and next-generation physics-based workflows.

Culture & Benefits

• Remote work with close collaboration across Sales, Product, and Engineering.
• Work at the intersection of AI models, fundamental physics, and high-stakes enterprise hardware design.
• Collaborate with engineers and researchers in a fast-moving startup environment.
• Participate in redefining how next-generation silicon and hardware are architected.