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11 часов назад

Principal Digital Design Engineer (Semiconductor)

190 000 - 240 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US/Japan/China
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Digital Design Engineer (Semiconductor): Architecting, designing, and implementing digital and mixed-signal ICs from product conception through production release with an accent on SoC architecture, RTL design flow, and silicon delivery. Focus on defining chip architecture, debugging circuits, evaluating silicon, supporting production test development, and coordinating development across sites in the United States and China.

Location: San Jose, California, United States; remote work is not available

Annual pay range: $190,000–$240,000, plus eligibility for bonus opportunities.

Company

hirify.global is a publicly traded semiconductor company developing hardware and software solutions for automotive, industrial, infrastructure, IoT, robotics, automated factory, and smart home applications.

What you will do

  • Architect, design, and implement digital and mixed-signal integrated circuits.
  • Lead development from product conception through production release, delivering high-quality silicon on schedule and within cost targets.
  • Define chip architecture, partition designs, assign blocks, and develop RTL.
  • Perform simulation, synthesis, design-for-test, and timing checks.
  • Prepare design documentation, evaluate silicon, debug circuits, and support production test development.
  • Provide customer and applications support and help define technology requirements for future products.

Requirements

  • MSEE or Ph.D. in Electrical Engineering with 8+ years of relevant industry experience, or BSEE with 12+ years.
  • Proven experience in SoC architecture, bus matrices, AHB/APB/AXI, USB, I2C/I3C, SPI, UART, and packet-oriented protocols.
  • Knowledge of embedded memories including SRAM, OTP, MTP, and EE/Flash memory.
  • Hands-on experience with chip architecture definition, partitioning, RTL coding, simulation, synthesis, DFT, and timing checks.
  • Strong communication, teamwork, motivation, and creativity.
  • AI-savvy approach and experience leveraging AI in daily work.

Nice to have

  • Mixed-signal knowledge and mixed-signal chip development experience.
  • Project management skills.
  • DDR DRAM and Flash memory knowledge.
  • Bilingual or Mandarin fluency.

Culture & Benefits

  • Collaboration with teams at other United States sites and in China.
  • Medical, dental, vision, life insurance, AD&D, disability, and pet insurance options.
  • Health savings and flexible spending accounts, plus pre-tax commuter benefits.
  • Paid sick time, holidays, and accrued vacation for eligible employees.
  • Benefit orientation and access to company resources.

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