Product Development Engineer (Semiconductor Equipment)

Location: Singapore, Singapore; onsite, full-time

Company

hirify.global develops metrology, inspection, and process-control systems for the semiconductor manufacturing ecosystem, with a focus on wafer and defect inspection technologies.

What you will do

• Design, develop, and implement mechanical and opto-mechanical subsystem updates for released semiconductor inspection products.
• Develop precision mechanisms, structures, and assemblies, including tolerance analysis, GD&T, and design documentation.
• Perform structural, thermal, vibration, and modal analyses to support design decisions.
• Investigate field, factory, and reliability issues through root cause analysis, testing, and corrective and preventive actions.
• Lead or support ECR/ECO processes, maintain drawings, BOMs, and specifications, and manage component obsolescence and replacement-part qualification.
• Collaborate with systems, electrical, optics, manufacturing, supply chain, service, and supplier teams to support builds, troubleshooting, DFx improvements, cost reduction, and reliability enhancements.

Requirements

• Bachelor’s degree in Mechanical Engineering or a related field.
• 2–5 years of relevant experience, typically at the P2 level.
• Experience designing mechanical systems or complex equipment.
• Proficiency with CAD tools such as Creo or SolidWorks.
• Hands-on troubleshooting and root cause analysis experience, with knowledge of manufacturing processes such as machining, sheet metal, and injection molding.
• Ability to work independently on moderately complex technical issues and communicate clearly across global engineering teams.

Nice to have

• Experience with semiconductor capital equipment or precision instrumentation.
• Familiarity with vacuum systems, precision stages, or mechatronics.
• Experience with structural, thermal, or vibration analysis.

Culture & Benefits

• Competitive, family-friendly total rewards package.
• Benefits designed to support diverse employee needs.
• Inclusive and equal-opportunity work environment.
• Occasional travel of approximately 10–20% to customer sites, manufacturing locations, and suppliers.

Hiring process

• Recruiting includes multiple interviews conducted in person or by video conference with hiring managers.