Process Engineering Intern (Hybrid Bonding)

Location: Singapore, SGP; full-time, onsite role. Relocation is not available.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.

What you will do

• Design, collect data, analyze results, and compile reports for entry-level process engineering experiments.
• Support process engineers with tool development and design of experiments execution.
• Collect, analyze, and interpret data to characterize industrial systems under development.
• Operate a variety of industrial and laboratory surface, material, structural, topographic metrology, and inspection tools.
• Work with advanced packaging and hybrid bonding system development in a cleanroom environment.

Requirements

• Student or intern status with conceptual knowledge in the relevant engineering discipline.
• Hands-on approach, analytical thinking, and self-motivated learning.
• Ability to solve straightforward technical problems using judgment, experience, and established precedents.
• Ability to explain complex information clearly and collaborate with coworkers and project resources.
• Ability to work onsite in Singapore; relocation is not available.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Exposure to a leading global semiconductor technology company.
• Health and wellbeing programs supporting personal and professional development.
• Strong intern performance may lead to priority consideration for the core development team after graduation.
• No travel is required.