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1 день назад

Design Engineer (Semiconductor Machinery Hardware)

120 000 - 150 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Design Engineer (Semiconductor Machinery Hardware) (Semiconductor fabrication equipment/additive manufacturing): Designing and redesigning precision hardware for wafer handling, vacuum systems, thermal management, fluid delivery, lithography, and deposition tools with an accent on first-principles part design, manufacturability, materials, tolerances, and performance tradeoffs. Focus on developing novel additive-manufactured geometries, qualifying hardware for production, solving complex semiconductor equipment constraints, and collaborating with engineering and customer teams.

Location: Los Angeles, California; full-time onsite presence in Hawthorne five days per week

Salary: $120,000–$150,000 per year, plus stock options

Company

hirify.global builds AI-native manufacturing systems that integrate software, hardware, and physics to produce industrial-scale parts.

What you will do

  • Design and redesign semiconductor fabrication hardware, including wafer-handling components, robotic end-effectors, vacuum-compatible armatures, cold plates, UHV chambers, gas manifolds, fluid systems, optics mounts, pedestals, and showerhead assemblies.
  • Analyze component requirements, system constraints, materials, tolerances, thermal behavior, structural performance, manufacturability, and production considerations.
  • Apply additive manufacturing to develop new geometries, consolidate assemblies, improve performance, and reduce cost and lead time.
  • Evaluate design concepts, process capabilities, qualification pathways, and production scalability.
  • Collaborate with internal engineering and operations teams to establish feasibility and execute designs.
  • Work directly with customer engineering teams and provide application feedback for product, process, and technology roadmaps.

Requirements

  • Bachelor’s degree in mechanical engineering or a closely related technical discipline.
  • 5+ years of hands-on engineering experience in the semiconductor equipment or fabrication industry.
  • Strong understanding of part design, design for manufacturing, component geometry, performance, and producibility.
  • Systems-level understanding of semiconductor fabrication hardware and component integration within larger assemblies.
  • Ability to reason independently about design tradeoffs, materials, tolerances, process capabilities, and production scalability.

Nice to have

  • Experience with wafer-handling systems, vacuum hardware, thermal management components, fluid delivery systems, or precision structural assemblies.
  • Experience with additive manufacturing, casting, forging, or advanced machining.
  • Experience taking hardware through development, qualification, and production ramp.
  • Ability to communicate complex technical concepts to engineering and non-engineering stakeholders.
  • Strong first-principles reasoning and experience working in ambiguous, fast-moving environments.

Culture & Benefits

  • Inclusive, diverse, collaborative culture focused on learning and deliberate data-driven decisions.
  • Significant stock option package and employer-paid medical, dental, and vision insurance.
  • Life insurance, traditional and Roth 401(k), paid vacation, sick leave, company holidays, and paid parental leave.
  • Relocation assistance is provided.
  • Free catered lunch and dinner, flexible work hours, casual dress, and regular catered team-building events.

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