Staff Process Engineer (Power QFN)

Location: Bayan Lepas, Malaysia; onsite work required

Company

hirify.global is a semiconductor solutions provider developing technology for automotive, industrial, infrastructure, and IoT applications.

What you will do

• Design packages and develop processes to qualify Power QFN packages for Smart Power Stage products and related modules.
• Ramp up manufacturing volume and qualify production sources.
• Sustain assembly lines and improve yield, capacity, quality, and cost.
• Resolve internal and external customer issues in collaboration with Test, Product Engineering, Quality, and Operations.
• Manage product lifecycle documentation and supplier change management.
• Support NPI-to-production transfers and manage OSAT and contract manufacturing relationships.

Requirements

• Degree in Mechanical Engineering, Materials, Physics, Chemistry, or Applied Sciences.
• Experience in process engineering or package development involving thin-wafer handling and SPS solder attach processes.
• Knowledge of quality and reliability requirements for PQFN, QFN, WLCSP, and leaded packages.
• Knowledge of wire bonding, SPC, and statistical analysis software such as JMP.
• Strong English communication skills required.
• Strong analytical, written communication, presentation, and project management skills.

Nice to have

• Experience with Cu Clip, Thin Die, and Power QFN technologies.
• Package development experience.
• Experience transitioning products from development to production and supporting NPI through mass production.

Culture & Benefits

• Regular full-time employment with a competitive benefits package.
• Collaborative work across a global organization of engineers and problem solvers in more than 30 countries.
• Culture built around transparency, agility, global collaboration, innovation, and entrepreneurship.
• Work on semiconductor technology supporting automotive, industrial, infrastructure, and IoT applications.