15 часов назад
NAND Array Engineer (3D NAND)
139 520 - 255 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
NAND Array Engineer (3D NAND): Characterizing NAND memory cell and array erase, program, and read operations while developing trims for next-generation memory products with an accent on device physics, reliability, and data analysis. Focus on optimizing Read Window Budget and Raw Bit Error Rate, building predictive models, and driving wafer-level reliability experiments and production yield improvements.
Location: Hybrid role based in Rancho Cordova, California, or San Jose, California, United States
Salary: USD 139,520–255,000 yearly, plus eligibility for RSU, RCU, and cash bonus programs.
Company
is a global memory technology company developing 3D NAND products and optimized data storage solutions.
What you will do
- Design, plan, and execute NAND memory cell and array characterization experiments for performance and reliability.
- Develop and optimize trims to improve Read Window Budget and Raw Bit Error Rate.
- Apply NAND device physics to interpret experimental data and trim parameter relationships.
- Collaborate with Device, Design, Reliability, Product, and Test Engineering teams on bench experiments.
- Interface with wafer fabrication teams on Sort and Wafer-Level Reliability design-of-experiments.
- Analyze data, build predictive models, maintain degradation scorecards, and release improvements to production flows.
Requirements
- Master’s or PhD in Electrical Engineering, Microelectronics, or a closely related field.
- 3+ years of industry experience with semiconductor memory technologies and products.
- Strong understanding of NAND cell and array operations, reliability mechanisms, characterization techniques, semiconductor device physics, and process flows.
- Proficiency in statistical analysis methodologies and tools.
- Hands-on programming experience in C, C++, Python, and/or JMP.
- Strong analytical, problem-solving, communication, and cross-functional collaboration skills.
Nice to have
- Experience with 3D NAND architecture and advanced memory scaling challenges.
- Familiarity with wafer fabrication processes and Sort/WLR test methodologies.
- Experience releasing trims or process improvements to high-volume manufacturing.
- Experience with machine learning or advanced modeling techniques for semiconductor data.
Culture & Benefits
- Medical, dental, vision, supplemental life, AD&D, short-term disability, and long-term disability insurance.
- Healthcare and dependent care flexible spending accounts.
- Company match on eligible 401(k) plan contributions.
- Inclusive, collaborative, customer-inspired, and results-driven work environment.
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