Associate Packaging Engineer (Manufacturing)

Location: Batu Kawan, Penang, Malaysia — onsite at the Penang SDSM Office

Company

hirify.global develops Flash memory and advanced memory technology solutions supported by global manufacturing capabilities and a worldwide supply chain.

What you will do

• Develop new processes for new product introduction and transfer them to high-volume manufacturing without major quality issues.
• Analyze and optimize manufacturing processes to improve efficiency and product quality.
• Design experiments, troubleshoot process issues, and validate improvements using process data.
• Implement continuous improvement initiatives using Six Sigma and Lean methodologies.
• Maintain process documentation, standard operating procedures, and work instructions.
• Collaborate with process, equipment, factory automation, and IT teams to deliver robust automation solutions and support production personnel.

Requirements

• Bachelor’s or Master’s degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or a related engineering discipline.
• Strong troubleshooting, analytical, and root-cause investigation skills.
• Ability to collect, organize, analyze, and interpret process data.
• Strong attention to detail and commitment to achieving goals.
• Ability to adapt to changing priorities and work effectively in a fast-paced manufacturing environment.

Nice to have

• Fresh graduate status.
• Proficiency in statistical data analysis and process simulation software.

Culture & Benefits

• Full-time exempt position.
• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Accessibility support is available throughout the application and hiring process.