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9 часов назад

Mechanical Engineer III (Semiconductor Equipment)

106 000 - 159 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Mechanical Engineer III (Semiconductor Equipment): Designing and validating mechanical components, assemblies, and subsystems for next-generation ion implantation systems with an accent on 3D CAD, engineering analysis, testing, and manufacturability. Focus on performing tolerance, thermal, and structural analyses, troubleshooting design issues, and integrating mechanical solutions with electrical, controls, manufacturing, sourcing, and service teams.

Location: Beverly, MA, United States; onsite

U.S. base salary: $106,000–$159,000 per year, plus eligibility for a team incentive bonus and benefits for regular employees working 20+ hours per week.

Company

hirify.global develops advanced ion implantation and semiconductor capital equipment used by semiconductor manufacturers worldwide.

What you will do

  • Design mechanical components, assemblies, and supporting hardware for semiconductor equipment.
  • Create and maintain 3D CAD models, drawings, GD&T documentation, and engineering records.
  • Translate system and product requirements into mechanical design solutions.
  • Perform tolerance stack-ups, thermal and structural analyses, prototype builds, testing, and design verification.
  • Analyze test data, troubleshoot design and system-level issues, and support root cause investigations.
  • Collaborate with electrical, controls, manufacturing, sourcing, and service teams through design reviews, engineering changes, and product release.

Requirements

  • Bachelor’s degree in Mechanical Engineering or a related engineering discipline.
  • 0–3 years of mechanical engineering experience, including internships or co-op experience.
  • Experience with 3D CAD software; Creo is preferred or an equivalent tool.
  • Understanding of statics, dynamics, materials, machine design, engineering drawings, and GD&T principles.
  • Strong analytical, problem-solving, written, and verbal communication skills.
  • Ability to work effectively in a collaborative engineering environment.

Nice to have

  • Product design or electromechanical systems experience from internships, co-ops, or projects.
  • Exposure to manufacturing processes and assembly methods.
  • Experience with FEA or other engineering analysis tools, laboratory testing, and data analysis.
  • Interest in automation, robotics, vacuum systems, precision mechanisms, or semiconductor equipment.

Culture & Benefits

  • Hands-on work with advanced semiconductor capital equipment and complex electromechanical systems.
  • Collaboration with experienced engineers and technical experts.
  • Opportunities to build expertise in mechanical design, testing, and system integration.
  • Technical and professional development path within a growing engineering organization.
  • Team incentive bonus eligibility and comprehensive benefits for qualifying regular employees.

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