Mechanical Design Engineer (Semiconductor)

Location: Milpitas, California, USA

Salary: $117,800–$200,300 annually

Company

hirify.global develops metrology, inspection, and process-control systems for the semiconductor manufacturing ecosystem.

What you will do

• Design UHV and HV subsystems, precision mechanical assemblies, and supporting hardware for semiconductor inspection modules.
• Create 3D CAD models, assemblies, engineering drawings, and bills of materials using Creo/ProE or similar tools.
• Perform structural, thermal, vibration, finite element, tolerance stack-up, and error-budget analyses.
• Support product redesign, prototype builds, assembly, integration, qualification, troubleshooting, and manufacturing introduction.
• Collaborate with systems, electron optics, electrical, manufacturing, supply chain, service, and supplier teams.
• Investigate failures, resolve manufacturability issues, and drive root-cause corrective actions.

Requirements

• Doctorate with 0 years of related experience, master's degree with 3 years, or bachelor's degree with 5 years of related experience.
• Strong foundation in mechanical engineering, physics, precision engineering, and mechanical design.
• Experience designing assemblies for vacuum, UHV, or cleanroom environments.
• Knowledge of high-voltage insulation, creepage, clearance, and electrical interface considerations.
• Experience with GD&T, tolerance analysis, precision manufacturing, FEA, and engineering simulation tools.
• Working knowledge of machining, sheet metal fabrication, welding, brazing, vacuum-compatible materials, cleaning, and contamination control.

Culture & Benefits

• Cross-functional work on semiconductor inspection products and advanced manufacturing systems.
• Medical, dental, vision, life, and other voluntary benefits.
• 401(k) with company matching and employee stock purchase program.
• Tuition reimbursement, student debt assistance, career development, and financial planning benefits.
• Paid time off, company holidays, wellness support, and family care and bonding leave.

Hiring process

• Multiple interviews with hiring managers, conducted in person or by video conference.