Назад
Company hidden
5 дней назад

Back-End TD Reliability Lab Manager (Semiconductor Packaging)

180 770 - 255 200$
Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Back-End TD Reliability Lab Manager (Semiconductor Packaging) (Reliability Engineering): Leading a semiconductor packaging reliability laboratory and an 8–10-person engineering team with an accent on qualification, stress testing, quality systems, and Quick Turn Monitoring. Focus on building laboratory capabilities, solving complex reliability and technology challenges, and preparing the quality management system for ISO 17025 accreditation.

Location: On-site in Phoenix, Arizona, United States

Annual salary: $180,770–$255,200 USD

Company

hirify.global Foundry develops semiconductor technologies, manufacturing processes, advanced packaging, reliability solutions, and laboratory capabilities.

What you will do

  • Manage, hire, coach, and develop a team of 8–10 laboratory engineers.
  • Define and execute the laboratory capability and capacity roadmap for future customer and technology requirements.
  • Develop strategies for data collection and qualification of emerging semiconductor packaging technologies.
  • Establish and advance Reliability Quick Turn Monitoring methodologies to accelerate technology development and decision-making.
  • Partner with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to resolve complex technical challenges.
  • Develop the laboratory quality management system and lead readiness efforts for ISO 17025 accreditation, including 8D and root cause analysis.

Requirements

  • Master’s degree in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or a related technical discipline.
  • At least 3 years of engineering management experience in semiconductor packaging, reliability, test, or validation engineering.
  • At least 2 years of hands-on experience with reliability stress and testing.
  • Expertise in process qualification, reliability risk assessment, quality management systems, and quality culture development.
  • Strong communication, stakeholder management, relationship-building, and cross-organizational leadership skills.
  • Ability to work on-site in Phoenix, Arizona, United States.

Nice to have

  • Knowledge of reliability statistics, life prediction, accelerated life testing, and AQL/SQL sampling plans.
  • Experience with dynamics testing, including shock and vibration, to JEDEC or other standards.
  • Experience with JESD47 stress requirements and advanced packaging assembly processes.
  • Knowledge of design rule scaling and defect failure modes.
  • Experience coordinating and auditing third-party stress laboratories.

Culture & Benefits

  • Work within a global Foundry Lab Network supporting advanced packaging innovation.
  • Access to health, retirement, and vacation benefits.
  • Competitive compensation with stock bonuses.
  • Focus on operational excellence, quality leadership, continuous improvement, and customer responsiveness.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →