Staff Digital Design Engineer (NAND Flash)

Location: Seoul, Republic of Korea; onsite at the Seoul Office

Company

hirify.global develops Flash memory and advanced memory technology products supported by large-scale manufacturing capabilities and global operations.

What you will do

• Lead and deliver digital design projects for 3D NAND Flash memory.
• Develop and verify RTL in Verilog, including linting, clock domain crossing analysis, and design integration.
• Perform synthesis, DFT, timing analysis, and timing closure while balancing power, performance, area, modularity, and scalability.
• Define technical specifications and features with internal teams, external teams, and customers.
• Support post-silicon evaluation, debugging, and productization across functions.
• Provide technical guidance and mentoring to junior engineers.

Requirements

• MSEE and 6–8 years of relevant experience.
• Experience with chip-level integration, chip leadership, and the full logic-design product lifecycle from requirements through testing.
• Working knowledge of the complete RTL-to-GDSII flow, including simulation, synthesis, static timing analysis, logic equivalence, DFT insertion, place-and-route, clock tree synthesis, extraction, and physical verification.
• Knowledge of NAND Flash memory cell operations and program, read, and erase algorithms.
• Strong written and verbal communication, interpersonal skills, troubleshooting ability, teamwork, and deadline management.

Nice to have

• Experience designing digital circuits for low-power operation and knowledge of device physics and semiconductor processes.
• Knowledge of NAND Flash analog, core, datapath, and I/O circuits.
• Experience with Synopsys or Cadence tools for synthesis, static timing, and place-and-route.
• Familiarity with revision control, Liberty timing models, and SDC constraints.
• Programming experience in C, C++, Python, or Perl.

Culture & Benefits

• Entrepreneurial, fast-paced work environment within the Memory Technology organization.
• Collaborative work across engineering teams and with external partners and customers.
• Opportunity to contribute to advanced 3D memory technology and innovation.
• Inclusive environment focused on diversity, belonging, respect, and contribution.