Quantum 3D Integration and Packaging Engineer (Quantum Technology)

Location: Santa Clara, California, United States

Salary: $147,000–$202,500 per year

Company

hirify.global develops materials science, semiconductor processing, advanced packaging, and engineering solutions used in semiconductor chips and advanced displays.

What you will do

• Create 3D integration and packaging solutions for quantum platforms and structures.
• Develop materials, processes, hardware, and metrology approaches for quantum devices.
• Design and conduct process engineering experiments, collect and analyze data, and interpret material and device properties.
• Troubleshoot complex engineering issues, perform root cause analysis, and implement solutions.
• Prepare product documentation, presentations, and technical reports.
• Collaborate with customers, startups, universities, and R&D teams to identify problems and develop enabling technologies.

Requirements

• Doctorate degree.
• Strong background in semiconductor engineering and 3D integration.
• Practical expertise in the relevant engineering discipline and working knowledge of related disciplines.
• Ability to solve complex problems using analysis from multiple information sources.
• Ability to explain difficult or sensitive technical information and build consensus.
• Willingness to travel approximately 10% of the time.

Culture & Benefits

• Supportive environment focused on learning, professional development, and technical growth.
• Work with R&D teams on quantum information, superconducting qubits, optical quantum computing, and advanced materials engineering.
• Opportunity to explore new growth areas in precision materials engineering.
• Comprehensive benefits package, with potential bonus and stock award eligibility.
• Relocation support may be available for eligible candidates.