Director, Advanced Packaging Disruptive Technology (Semiconductor Packaging)

Location: Singapore, SGP. Work location: Science Park II, moving to Tampines at the end of 2026. Travel is approximately 10–20% for customer engagement, ecosystem collaboration, and industry events.

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays, enabling technologies such as AI and IoT.

What you will do

• Define and execute long-range N+2 and beyond pathfinding roadmaps for advanced packaging, including integration, interconnect, materials, and architecture inflections.
• Lead concept incubation and feasibility exploration for disruptive approaches such as D2W, RDL, CoWoS, TSV, heterogeneous integration, and advanced substrates.
• Build and lead a high-impact pathfinding and innovation team, establishing frameworks for ideation, incubation, prototyping, and technology down-selection.
• Translate customer roadmaps, system architecture trends, and market needs into technology development strategies and differentiated product concepts.
• Develop partnerships with materials suppliers, substrate vendors, OSATs, foundries, equipment partners, research institutions, and industry consortia.
• Establish governance for early-stage programs and align engineering, product, and business units to transition concepts into development pipelines.

Requirements

• 15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
• Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong understanding of current advanced packaging technologies, including D2W, RDL, CoWoS, and TSV, with the ability to develop new approaches.
• Experience building and leading cross-functional or exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.

Nice to have

• Advanced degree in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related field.
• Experience delivering disruptive or first-of-a-kind technology solutions.
• Experience with heterogeneous integration, chiplet ecosystems, or next-generation packaging architectures.
• Strong network across industry and research communities.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Environment encouraging bold thinking, experimentation, calculated risk-taking, collaboration, and accountability.
• Employee health and wellbeing programs supporting personal and professional growth.
• Regular engagement with customers, ecosystem partners, and industry events.
• Relocation eligible.