Head of Product Development Engineering (Semiconductor)

Location: San Jose, CA, United States; hybrid

Salary: $220,000–$280,000 annual base salary, plus incentive compensation in the form of pre-IPO ISO options and benefits

Company

hirify.global develops Ethernet-based networking, data transport, and acceleration technology for software-defined and autonomous vehicles, robotics, and other intelligent machines.

What you will do

• Lead product development engineering for semiconductor products from new product introduction through high-volume manufacturing.
• Own end-to-end product testing and hardware readiness from pre-silicon through post-silicon, collaborating with architecture, design, software/firmware, DFT, systems, test, and quality teams.
• Execute NPI bring-up for high-speed Ethernet switch and PHY products while maintaining signal integrity and power/performance standards.
• Drive manufacturing flow from wafer starts through sample delivery and own wafer, final, and system-level test strategies.
• Lead characterization, ATE-to-system correlation, productization, manufacturing specifications, margins, and silicon/package qualification.
• Improve yield across process, package, and test while reducing test time and cost and meeting automotive quality requirements.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering or a related technical field.
• 12+ years of experience in fabless semiconductor operations for complex, high-performance SoCs or networking ICs.
• Direct experience with ATE and SLT testing, characterization, ATE-to-system correlation, productization, and silicon/package qualification.
• Experience working with foundries, assembly houses, test houses, and OSATs on high-volume products from NPI through HVM.
• Expertise in iJTAG, Scan, MBIST, sensor, SerDes, LSIO/HSIO, bare-metal, functional DVFS, benchmark testing, and security fusing.
• Experience with automotive electronics standards and processes, including IATF 16949, ISO 26262, safe launch, and PPAP.

Nice to have

• Familiarity with FinFET process nodes and QFN, LGA, or BGA assembly for automotive products.
• Experience delivering high-speed SerDes products to Tier-1 automotive OEMs.
• Experience managing contractors and providing technical leadership.

Culture & Benefits

• Opportunity to work on cutting-edge networking technology for vehicles, robotics, and intelligent machines.
• Flexible hours and the opportunity to grow with a fast-paced startup.
• Pre-IPO stock options and competitive compensation.
• Medical, dental, and vision insurance.
• Exposure to deep semiconductor expertise and collaboration with a distributed team across four continents.