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1 день назад

Sr Engineer Field Application Engineering (Semiconductor)

67 000 - 109 000$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr Engineer Field Application Engineering (Semiconductor): Engaging semiconductor customers to identify suitable GF Power, BCD, 22FDX, and FinFET technology solutions from architecture through tapeout with an accent on technical customer engagement, competitive positioning, and cross-functional solution development. Focus on resolving adoption barriers, creating application-specific proposals, and converting design wins into tapeout and revenue.

Location: Santa Clara, United States; up to 20% travel, primarily domestic with some international travel.

Expected salary: $67,000–$109,000 per year. Exact salary depends on qualifications, experience, and location.

Company

hirify.global is a full-service semiconductor foundry providing design, development, and fabrication services across a global manufacturing footprint.

What you will do

  • Engage with customers to understand technical needs for semiconductor IC product development.
  • Assess competitive technologies and advocate winning hirify.global value propositions.
  • Work with account managers, product marketing, and technical experts to create application-specific technology presentations and proposals.
  • Combine technical and commercial requirements into design-winning proposals.
  • Identify and resolve issues that could prevent conversion from design win to product tapeout.
  • Advocate internally for improved features and capabilities where competitive gaps exist.

Requirements

  • Bachelor’s or master’s degree in electrical engineering or an equivalent field such as applied physics.
  • At least 5 years of experience in semiconductor design, tapeout, and process development.
  • Working knowledge of IC design flows and tools from architectural definition through performance characterization.
  • Experience with BCD and leading-edge technologies such as 22FDX and FinFET.
  • Fluent written and verbal English is required.
  • Strong problem-solving, communication, teamwork, ownership, planning, and organizational skills.

Nice to have

  • Master’s or PhD in electrical engineering or an equivalent field.
  • Semiconductor product design experience at chip or module level, preferably in RF design.
  • Experience with digital, analog mixed-signal, high-voltage power, eNVM, or millimetre-wave IC product design.
  • SoC product integration or design experience.
  • Technical or project management skills and the ability to navigate ambiguity.

Culture & Benefits

  • Cross-functional collaboration with account management, product marketing, and technical experts.
  • Work on semiconductor technologies supporting customer product development through tapeout.
  • Commitment to environmental, health, safety, security, and equal-opportunity programs.
  • Reasonable accommodations are available during the employment process.

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