Principal Packaging Engineer (Signal Integrity)

Location: Ottawa, Ontario, Canada

Salary: $150,000–$164,000 per year

Company

Develops high-performance mixed-signal ICs and packaging solutions for data communications, video broadcast, and hyperscale datacenter connectivity.

What you will do

• Design high-speed IC packages and Chip-On-Board solutions that meet technical, financial, quality, and reliability requirements.
• Perform 3D signal integrity modeling across silicon, package, and system levels, validating designs with S-parameter and TDR measurements.
• Prepare technical reports, application notes, PCB layout guidance, and assembly process instructions for internal and customer-facing audiences.
• Design PCB and high-density substrate layouts for reliability qualification and electrical performance evaluation.
• Serve as the technical interface with manufacturing suppliers throughout NPI, package definition, design, and qualification.
• Evaluate strategic suppliers and emerging packaging technologies, mentor junior engineers, and improve design methodologies, tools, and workflows.

Requirements

• Bachelor’s degree in Electrical Engineering, Physics Engineering, or a related field, plus 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
• Deep expertise in high-speed transmission line theory, multi-domain power delivery network design, and package-level signal integrity, including crosstalk, impedance control, and return-loss optimization.
• Hands-on proficiency with Keysight ADS, Cadence APD/SiP, and Ansys HFSS.
• Experience with RF/SI measurement equipment, including Vector Network Analyzers and Time-Domain Reflectometers.
• Familiarity with 2D, 2.5D, and 3D packaging, Fan-In, Fan-Out/FOCOS, high-density substrates, silicon bridge interconnects, and Chip-On-Board.
• Working knowledge of JEDEC specification JESD47H and its design implications.
• Ability to manage supplier relationships and drive technical alignment throughout NPI and package qualification.
• Strong written and verbal communication skills and the ability to produce high-quality technical documentation.

Nice to have

• Experience with optoelectronics package design, opto-electronic package assembly, or photonic integration.
• Master’s degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.
• Background in datacenter or high-speed communications product development, including 400G, 800G, or 1.6T products.
• Familiarity with thermo-mechanical simulation, finite element analysis for package stress modeling, and reliability engineering methodologies.
• Experience in a fabless semiconductor environment with global contract manufacturing partners.

Culture & Benefits

• Technically challenging work at the intersection of speed, density, and reliability.
• Collaboration with digital, analog, physical, systems, quality, reliability, and manufacturing engineering teams.
• Pay-for-performance compensation philosophy with competitive compensation and benefits.
• Equity participation and support for technical and professional growth.
• Equal opportunity and drug-free workplace.