Power Delivery Design Engineer (AI)

Location: On-site in Toronto, Canada.

Company

Develop hardware and platform solutions for Intel products, including next-generation GPUs and AI accelerators, within the GPE department.

What you will do

• Design and develop end-to-end power delivery solutions, from requirements and power IC ecosystem enablement through implementation.
• Build and correlate VRM-to-die power delivery network models; perform DC IR-drop, AC target-impedance, transient droop, and Ldi/dt analyses across die, package, and PCB.
• Design and optimize power conversion, management, stack-up, power and ground plane, decoupling, sequencing, and energy-management solutions.
• Architect board observability and flexibility through sense points, telemetry, rail isolation, voltage margining, configurable regulator footprints, and multi-SKU support.
• Create and execute validation and characterization plans, correlate bench and VR measurements with simulations, and improve model accuracy.
• Investigate power delivery failures, implement corrective actions, and collaborate with silicon, platform, board, SW/FW, and systems validation teams on design guides and customer collateral.

Requirements

• Bachelor's or Master's degree in Electrical Engineering or a related field.
• 5+ years of experience designing low-voltage, high-current, multi-phase DC-DC switching regulators, including transient-response and conversion-efficiency optimization.
• Experience with signal integrity, power integrity, and power delivery network simulation tools such as Cadence Sigrity PowerDC/PowerSI and Ansys SIwave.
• Experience developing power delivery simulation models with SPICE and time-based simulation tools such as LTspice and SIMPLIS based on SoC power requirements.
• Experience modeling power delivery networks across die, package, and PCB, including stack-up, plane assignment, decoupling networks, S-parameter extraction, and correlation.
• Experience using oscilloscopes and DAQ equipment for hardware troubleshooting and debugging.
• Experience interacting with Signal Integrity, Layout, and Mechanical engineers, with working knowledge of SI/PI, PCB layout, and mechanical aspects of board design.

Nice to have

• Experience designing power delivery hardware for debug and testability, including sense and telemetry instrumentation, voltage margining, and rail isolation for post-silicon bring-up.
• Experience designing configurable power delivery solutions for multiple SKUs and derivative products from a single board design.
• Experience identifying new technologies and interfaces and developing board power delivery architecture.
• Project management experience, including leading projects and managing timelines and resources.
• Familiarity with emerging technologies such as GaN power devices and switched-capacitor topologies.
• Experience delivering high-volume production products and optimizing costs.
• Knowledge of board and power-management hardware, software, and firmware debugging.
• Willingness to provide hardware technical support to ODM/OEM board vendors and travel globally to meet internal teams and external customers.

Culture & Benefits

• On-site work model in Toronto, Canada.
• Collaboration with diverse, cross-functional teams working on competitive AI compute platforms.
• Opportunity to work on PCB design, manufacturing, testing, debugging, GPUs, and AI accelerators.
• Accessibility accommodations are available for applicants and employees with disabilities.