Lead Mechanical Engineer - Avionics

Company

Space and defense technology company developing launch vehicles and space systems for missions from Earth to the Moon and beyond.

What you will do

• Lead the design and architecture of ruggedized electronics packaging and structural components for launch vehicle and spacecraft PCB assemblies.
• Design and optimize electro-mechanical assemblies for extreme thermal and dynamic environments, including EMI/EMC compatibility and radiation resistance.
• Perform and review thermal, modal, random vibration, and shock analyses to verify structural integrity and environmental performance.
• Oversee test fixturing and ground support equipment, and lead vibration, shock, and thermal-vacuum qualification and acceptance campaigns.
• Create CAD models, engineering drawings, and technical documentation; lead PDR and CDR design reviews.
• Collaborate with PCB designers, multidisciplinary teams, vendors, and manufacturing partners while mentoring junior and mid-level engineers.

Requirements

• Bachelor of Science in Mechanical Engineering, Aerospace Engineering, or a related technical field.
• 5+ years of professional experience designing high-reliability electronics packaging and electro-mechanical assemblies, preferably in aerospace, defense, or automotive.
• Expertise in 3D CAD design, with NX preferred, and geometric dimensioning and tolerancing.
• Experience taking complex electro-mechanical products from concept through environmental qualification and production.
• Knowledge of thermal and structural calculations, tolerance stack-ups, bolt pre-loads, EMI/EMC shielding, and PCB solder-joint fatigue prediction.
• Ability to work with manufacturing methods and materials for spaceflight environments, including CNC machining, sheet metal, and additive manufacturing.

Nice to have

• Experience with NX CAD and FEA tools such as ANSYS.
• Experience designing multi-layer PCBA enclosures with thermal interface materials and CTE analysis.
• Systems-level understanding of launch vehicle architectures, instrumentation interfaces, and avionics master networks.
• Experience resolving DFM issues with external vendors and manufacturing partners.