Advanced Assembly Engineer (2.5-3D)

Location: Singapore, Singapore; hybrid workplace

Company

hirify.global develops impactful quantum computers for applications in healthcare, materials, aerospace, and other industries.

What you will do

• Develop assembly flows for quantum computing devices.
• Initiate assembly concepts and lead advanced IC assembly development using 2.5D and 3D technologies.
• Drive methodology, innovation, and productivity improvements in assembly development.
• Collaborate with external vendors and manage partners to ensure successful execution.

Requirements

• Deep technical expertise in semiconductor assembly, including wafer-level 2.5D/3D packaging and advanced IC assembly.
• Experience with Design for Manufacturing and Design for Test, common package technologies, and assembly materials.
• Familiarity with CAD tools, thermo-mechanical simulation, and finite element modeling for thermal, electrical, and mechanical simulations.
• Ability to resolve assembly reliability issues across wide temperature ranges and understand packaging failure mechanisms.
• Strong engineering problem-solving skills and solid physics fundamentals.
• PhD or master's degree in mechanical engineering, materials science, physics, packaging, or micro/nanofabrication.

Nice to have

• Experience developing technology PDKs.
• Knowledge of Through-Silicon Via, silicon processing, and thin-film techniques.
• Experience with electro-mechanical testing at cryogenic temperatures.
• High-voltage or power package qualification experience.
• Process engineering background.