Lead Hardware Engineer (Taiwan)

Location: Taiwan

Company

hirify.global is a Silicon Valley-based hardware startup developing infrastructure solutions for AI data centers, combining silicon, packaging, software, and systems innovations to improve performance, utilization, power efficiency, cost, and reliability.

What you will do

• Lead delivery of hardware systems and sub-assemblies from concept and specifications through design, qualification, and production release.
• Translate high-level concepts into detailed hardware specifications and create technology de-risking plans using supplier evaluation boards and early prototypes.
• Apply high-speed design practices, including signal integrity and power integrity analysis, to develop robust systems with optical and electrical I/O.
• Coordinate schematic entry, layout, manufacturability reviews, and build reviews with ODM and contract manufacturing partners.
• Drive hardware bring-up, EDVT, MDVT, EMI/EMC, safety, and other qualification testing.
• Lead root-cause analysis and corrective actions for issues found during development, qualification, and manufacturing.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a similar technical field.
• At least 10 years of system-level development experience in the server, computer, or networking industries.
• At least 5 years of experience as a lead or manager in a technology-driven product company.
• Experience working with ODM/CM design teams throughout the complete development and production lifecycle.
• Strong understanding of high-speed design and signal and power integrity considerations.
• Ability to lead the Taiwan team and collaborate with teams in Silicon Valley, Bangalore, and other locations.

Nice to have

• Master’s degree in Electrical Engineering or Computer Engineering.
• Experience designing systems with standards-based optical interfaces such as QSFP and OSFP.
• Proficiency with Ethernet, PCIe, MDIO, SPI, I2C, and JTAG.
• Understanding of FPGA design, power circuits, clocking, and mechanical or thermal considerations.
• Track record of delivering shipped products and excellent verbal and written communication skills.

Culture & Benefits

• Opportunity to work on next-generation AI infrastructure and high-performance data center technology.
• Collaboration with a world-class engineering team and international teams across multiple locations.
• Work on products validated by leading hyperscalers and supported by established silicon, packaging, and systems supply-chain partners.
• Base salary is determined according to skills, experience, qualifications, work location, market trends, and comparable employee compensation.