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7 дней назад

Principal FEOL/MOL Integration Engineer (Semiconductor)

148 320 - 209 425$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Principal FEOL/MOL Integration Engineer (Semiconductor): Defining and executing new FEOL/MOL process integration routes and building electrical test capability for semiconductor test vehicles with an accent on wafer execution, parametric testing, and cross-business-unit integration. Focus on designing process flows, coordinating DOEs and lot management, correlating electrical results with process parameters, and solving integration challenges across lithography, etch, films, wets, and CMP.

Location: Albany, TX, United States; onsite office and cleanroom/fab work required

Salary: $148,319.86–$209,424.67 per year

Company

hirify.global engineers, manufactures, sells, and services wafer-processing and semiconductor production equipment, as well as flat-panel display and thin-film photovoltaic equipment.

What you will do

  • Act as the principal technical authority for FEOL/MOL process integration while mentoring engineers as a senior individual contributor.
  • Define and build process integration routes across lithography, etch, films, wet processes, and CMP, including flow definition, mask planning, and split strategy.
  • Establish electrical test capability, covering test structure and PCM design, test-chip planning, probe-card and test-program coordination, and wafer-level parametric extraction.
  • Lead cross-business-unit projects across TEL business units, factories, and onsite partners.
  • Plan and execute process splits, DOEs, metrology, wafer runs, statistical analysis, and data-driven evaluation.
  • Resolve integration and process issues while maintaining rigorous quality, documentation, and data-integrity standards.

Requirements

  • FEOL/MOL semiconductor process integration experience, with a record of building processing routes from flow definition through wafer execution.
  • At least 8 years of related semiconductor engineering experience with a master's degree, 5 years with a PhD, or 10 years with a bachelor's degree.
  • Experience leading cross-functional or cross-business-unit technical projects, including planning and scheduling.
  • Hands-on experience with inline CDSEM, cross-sectional SEM, experiment design, and process or tool optimization.
  • U.S. work authorization is required.
  • Regular cleanroom/fab work is required, including extended use of cleanroom attire and lifting or carrying FOUPs.

Nice to have

  • Electrical or parametric test experience with structures such as MOSCAP, TLM, Kelvin, Van der Pauw, and BEOL daisy chains.
  • Lot management using SIVIEW MM/SM.
  • EUV lithography or 193i immersion experience.
  • JMP or equivalent statistical software, Excel, and measurement or analysis tools such as Quartz PCI.
  • Prior experience as a principal or senior individual contributor or driving multi-stakeholder technical programs.

Culture & Benefits

  • Full-time employment with a comprehensive benefits package.
  • Eligibility for bonus plans and long-term incentives may apply to certain roles.
  • Work takes place in a highly regulated environment with strict cleanliness and safety protocols.
  • The role combines office, laboratory, and cleanroom work, typically involving 4–6 hours per day at a computer.

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