3D Integration Engineer (Quantum Computing)

Location: Paris, France — On-site

Salary: €60,000–€78,000 yearly base salary

Company

hirify.global is a Paris-based quantum-computing startup developing carbon-nanotube-based quantum processors and scalable, fault-tolerant quantum-computing hardware.

What you will do

• Develop 2.5D and 3D integration architectures for quantum processors and supporting electronics.
• Design interposers, through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces.
• Integrate quantum processing units with cryogenic CMOS, RF/microwave circuitry, photonics, MEMS, and packaging substrates.
• Perform electrical, electromagnetic, mechanical, and thermal simulations.
• Define fabrication flows and design rules with foundries, packaging partners, and internal process teams.
• Develop test vehicles, measure fabricated devices, analyze experimental data, and document qualification results and technology roadmaps.

Requirements

• Bachelor’s or Master’s degree in electrical engineering, materials science, mechanical engineering, applied physics, or a related discipline.
• Experience with semiconductor packaging, wafer-level integration, MEMS, microfabrication, or heterogeneous integration.
• Familiarity with wafer bonding, hybrid bonding, TSVs, flip-chip assembly, thin-film deposition, lithography, etching, electroplating, or CMP.
• Knowledge of package-level electrical, thermal, and mechanical design.
• Experience with CAD, electromagnetic or multiphysics simulation, statistical analysis, or semiconductor process-development tools.
• Strong experimental, troubleshooting, documentation, and cross-functional communication skills.

Nice to have

• PhD or equivalent industry experience in advanced packaging or semiconductor integration.
• Experience with superconducting, semiconductor-spin, trapped-ion, neutral-atom, or photonic quantum-computing platforms.
• Experience with RF/microwave interconnects, photonic coupling, or high-density chiplet systems.
• Experience transferring packaging or integration processes into pilot or volume manufacturing.

Culture & Benefits

• Stock options for every employee.
• Sponsored conference travel, Swile meal vouchers, mental health support, and a training budget.
• Sabbatical leave after two years.
• International, multidisciplinary scientific environment with office spaces in central Paris, team lunches, and offsite events.