data centermechanical engineeringliquid coolingheat transferthermal engineeringai infrastructurethermal modelingicepakflotherm
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Текст:
Hirify AI/Оригинал
TL;DR
Thermal Engineer (AI Infrastructure) (thermal management/data center networking): Designing and implementing advanced cooling systems for high-power networking equipment used in AI infrastructures with an accent on heat transfer, thermal modeling, and system validation. Focus on developing heatsinks, cold plates, liquid cooling loops, and phase-change solutions, solving complex thermal challenges, and integrating reliable designs with cross-functional teams and suppliers.
Location: Santa Clara, California, United States
Company
hirify.global develops high-power next-generation networking systems for AI infrastructures.
What you will do
Design and develop thermal solutions including heatsinks, cold plates, liquid cooling loops, and other cooling systems.
Lead thermal modeling and simulations using industry-standard tools to optimize system performance.
Conduct thermal testing and validation against operational requirements.
Collaborate with cross-functional teams to integrate thermal designs into broader system architectures.
Build and manage technical relationships with suppliers to ensure high-quality thermal solutions.
Troubleshoot thermal challenges and track emerging thermal engineering technologies, trends, and standards.
Requirements
Bachelor’s degree in Mechanical Engineering or a related field with an emphasis on heat transfer is required; a master’s degree is preferred.
10+ years of experience in thermal design.
5+ years of experience designing thermal components and systems for data center network equipment is preferred.
Proficiency with thermal modeling tools such as Flotherm, Flotherm-XT, and/or IcePak.
Deep working knowledge of data center air-cooling technologies, including vapor chambers, heat pipes, phase-change devices, heat sinks, high-performance fans, thermal interface materials, environmental requirements, and rack-mounted ITE design constraints.
Deep knowledge of heat transfer principles and their application in real-world scenarios.
Strong problem-solving skills for complex thermal challenges.
Excellent collaboration and communication skills for working with diverse teams and suppliers.
A proactive mindset and interest in advancements in thermal technologies and AI infrastructure needs.
Nice to have
Experience designing liquid-cooling components and loops.
Culture & Benefits
Work on thermal solutions for next-generation AI and networking systems.
Contribute directly to the performance and reliability of AI infrastructure.
Collaborate with cross-functional teams and technical suppliers.
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