Thermal Engineer, Rack Level (AI Hardware)

Location: On-site in San Jose, United States. The team is fully in-person. Relocation support is available for candidates moving to San Jose.

Salary: $200,000–$350,000 annually, plus significant equity.

Company

hirify.global builds hardware for frontier intelligence by co-designing chips, racks, software, and manufacturing systems focused on high-throughput, low-latency inference.

What you will do

• Own the thermal design and validation of the L11 liquid-cooled rack system, including liquid loops, manifolds, quick disconnects, and facility interfaces.
• Develop and document deployment, filling, leak-checking, commissioning, and customer-site bring-up processes.
• Validate reference CDU systems through laboratory and field test plans, including qualification of CDU partners for thermal performance, reliability, and controls.
• Characterize flow distribution, pressure drop, supply and return temperatures, and other rack-level thermal and hydraulic performance metrics.
• Define cooling-loop control strategies and their interaction with datacenter facility control systems.
• Support customers, facility teams, suppliers, and go-to-market teams with facility integration, CDU selection and sizing, secondary-loop design, water requirements, and thermal or fluid-related issues.

Requirements

• 5–10 years of experience in thermal or mechanical engineering with direct, hands-on CDU and datacenter liquid-cooling experience.
• Experience installing, commissioning, or validating liquid-cooling systems at datacenter scale.
• Experience validating and commissioning CDUs, including flow, pressure, temperature, and controls testing.
• Strong working knowledge of datacenter cooling loops, including facility water, technology cooling systems, secondary loops, and their control systems.
• Comfort working directly with customers, facility teams, and suppliers to resolve integration issues.
• Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or a related field.

Nice to have

• Experience deploying rack-scale direct-to-chip liquid cooling for AI or HPC systems at a hyperscaler, server OEM, or CDU vendor.
• Familiarity with datacenter liquid-cooling guidelines such as OCP and ASHRAE TC 9.9.
• Experience with 1D flow-network or system-level thermal/hydraulic modeling tools such as Flownex or MacroFlow.
• Knowledge of coolant chemistry, filtration, leak detection, and fluid-integrity testing.

Culture & Benefits

• Fully in-person work at the San Jose office in Santana Row.
• Medical, dental, and vision packages with generous premium coverage.
• $500 monthly credit for waiving medical benefits.
• $2,000 monthly housing subsidy for employees living within walking distance of the office.
• Relocation support for moving to San Jose, wellness benefits, daily lunch and dinner, and an unlimited compute budget subject to ROI justification.
• Technical staff contribute across engineering and research and work across disciplines as needed.