Senior Substrate Technology Development Engineer (Semiconductor)

Location: Chengdu, China; onsite

Company

hirify.global develops integrated power semiconductors and power delivery systems, with a focus on technical innovation and sustainability.

What you will do

• Lead research, development, and qualification of next-generation substrate technologies for advanced semiconductor packaging.
• Drive innovation in substrate design, materials, and fabrication processes to meet performance, reliability, and cost targets.
• Collaborate with material suppliers, equipment vendors, and internal teams to evaluate and implement technical solutions.
• Define process, equipment, and engineering specifications for new substrate manufacturing facilities before mass production.
• Oversee process characterization, capability analysis, optimization, and yield ramp-up during factory startup.
• Lead root-cause analysis and resolution of issues involving substrate fabrication, thermal management, and reliability.

Requirements

• Deep knowledge of substrate materials and technologies, including SIP, advantage laminates PP, high-power substrates, and high copper thickness.
• Experience with substrate design rules, laser drilling, plating, lamination, and reliability testing.
• Proven experience with new factory startup, process baseline establishment, and yield ramp-up.
• Strong analytical skills with expertise in DOE, SPC, and failure analysis techniques.
• Bachelor’s degree and 10+ years of related experience.

Culture & Benefits

• Work within a global semiconductor technology company.
• Environment focused on creativity, sustainability, leading-edge products, and innovation.
• Equal opportunity employment and commitment to diversity.