Photonic Characterization Engineer (TFLN)

Location: Stuttgart, Germany

Company

hirify.global develops photonic processing systems that compute with light for energy-efficient next-generation AI and high-performance computing.

What you will do

• Design and execute GHz-regime characterization routines for thin-film lithium niobate photonic integrated circuits and photodiodes.
• Define, build, calibrate, and continuously optimize optical and RF test setups, including probe stations and measurement instrumentation.
• Develop Python, LabVIEW, and MATLAB tools for measurement automation, data acquisition, and statistical analysis.
• Contribute to photodiode-PIC hybrid integration from design coordination through assembly, validation, and packaging.
• Coordinate characterization campaigns, suppliers, service providers, and research partners while feeding performance results into product and technology roadmaps.
• Mentor junior engineers and technicians and maintain rigorous documentation, lab safety, and equipment-handling standards.

Requirements

• Ph.D. or Master’s degree in electrical engineering, photonics, or a related field.
• At least 5 years of relevant industry or research experience, including 1 year of GHz-regime high-speed photonic device testing.
• Strong understanding of LNOI device physics, high-speed modulation and detection, and RF signal integrity; hands-on TFLN experience is advantageous.
• Experience with photodiode characterization, hybrid photonic-electronic integration, PIC testing, optical alignment, and optoelectronic system bring-up.
• Hands-on experience with VNAs, high-speed oscilloscopes, optical spectrum analyzers, RF probes, tunable lasers, and optical/RF calibration methods.
• Fluent English is required. German is beneficial.

Culture & Benefits

• Work on photonic integrated circuit technologies for next-generation AI computing.
• Own characterization strategies, integration workflows, and roadmap inputs with direct impact on product development.
• Collaborate with an international, cross-functional team spanning photonics, electronics, and packaging.
• Work closely with company founders and senior leadership.
• Operate in a culture focused on technical excellence, open communication, and pragmatic problem-solving.