8 часов назад
Principal Systems/DSP Engineer (SerDes)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Principal Systems/DSP Engineer (SerDes): Defining DSP architectures and developing system models, equalization, CDR, and FEC algorithms for next-generation 224G and 448G PAM4 SerDes chiplet interconnects with an accent on power-efficient, manufacturable designs. Focus on optimizing link performance across PVT corners, translating algorithms into silicon-ready implementations, and validating DSP behavior through silicon bring-up and compliance testing.
Location: Bay Area, United States; Workplace: On-site
Company
is a chiplet startup developing high-performance, manufacturable interconnect and SerDes IP for next-generation chiplet-based systems.
What you will do
- Define low-power DSP architectures for 224G PAM4 and 448G SerDes designs, balancing power, performance, and area.
- Build behavioral models of mixed-signal transceiver circuits using MATLAB, Simulink, C, and/or Python.
- Develop and optimize equalization, adaptive channel-compensation, CDR, and FEC algorithms.
- Derive AFE, DAC/ADC, and PLL performance targets from BER and link-budget analyses.
- Collaborate with analog, digital RTL, verification, and physical design teams on silicon-ready implementations.
- Lead silicon bring-up, lab validation, characterization, interoperability, and standards-compliance testing.
Requirements
- Master’s or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
- 10+ years of DSP system architecture and algorithm-development experience in high-speed serial communications, including hands-on work at 112G PAM4 or higher.
- Expertise in digital communications, signal processing, PAM4, equalization, CDR loop dynamics, and statistical channel modeling.
- Expert-level proficiency in MATLAB, Simulink, C, and/or Python for production-quality behavioral modeling.
- Experience with 112G/224G SerDes products, tapeout or silicon characterization, and relevant Ethernet, PCIe, UCIe, and OIF CEI standards.
- Ability to work on-site in the Bay Area.
Nice to have
- Experience with chiplet die-to-die interconnects, optical/electrical interfaces such as VCSEL or EML, or DRAM/HBM PHY systems.
Culture & Benefits
- Work with a cross-functional team of experts operating from first principles.
- Participate in developing high-volume, high-performance, manufacturable products.
- Fun work environment with excellent benefits.
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