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8 часов назад

Staff Physical Design Engineer - SoC EMIR Engineer

Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Israel
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Staff Physical Design Engineer - SoC EMIR Engineer (Semiconductor): Analyzing IR drop and signal/power electromigration for complex SoCs in advanced FinFET nodes with an accent on power integrity, voltage-drop targets, and chip reliability. Focus on chip-package co-analysis, root-cause analysis of EMIR violations, and designing robust power grids for high-performance AI connectivity silicon.

Location: Tel Aviv-Yafo, Tel Aviv District, Israel

Company

hirify.global develops semiconductor-based connectivity solutions and software for rack-scale AI infrastructure, including CXL, Ethernet, NVLink, PCIe, and UALink technologies.

What you will do

  • Perform IR drop analysis and signal and power electromigration analysis for complex SoCs.
  • Develop and execute backend power methodologies for advanced semiconductor chips.
  • Collaborate with Physical Design engineers to ensure full power integrity.
  • Partner with Package Design engineers on chip-package co-analysis.
  • Identify root causes of voltage-drop violations and electromigration risks.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering or a related technical field.
  • 7+ years of hands-on experience in EMIR or power integrity analysis for high-performance SoCs or high-speed connectivity products.
  • Strong proficiency with industry-standard EMIR tools such as Ansys RedHawk, RedHawk-SC, or Cadence Voltus.
  • Deep understanding of EM/IR challenges in advanced FinFET nodes, including 7nm, 5nm, and 3nm.
  • Deep knowledge of place-and-route flows, power-grid synthesis, RC extraction, standard-cell architecture, and signal versus power-grid electromigration trade-offs.

Nice to have

  • Familiarity with thermal analysis tools and their interaction with electrical performance.
  • Experience with sign-off criteria and margins for high-volume production chips.
  • Good understanding of timing and place-and-route flows.
  • Basic understanding of packaging, top metal layers, MIM capacitor usage, and power distribution.
  • Ability to write TCL scripts for STA and Fusion Compiler.

Culture & Benefits

  • Opportunity to contribute technical ownership at a newly established strategic R&D center in Israel.
  • Work on connectivity silicon supporting large-scale AI and cloud environments.
  • Inclusive environment encouraging applications from people with diverse backgrounds and experiences.

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