8 часов назад
Staff Physical Design Engineer - SoC EMIR Engineer
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Staff Physical Design Engineer - SoC EMIR Engineer (Semiconductor): Analyzing IR drop and signal/power electromigration for complex SoCs in advanced FinFET nodes with an accent on power integrity, voltage-drop targets, and chip reliability. Focus on chip-package co-analysis, root-cause analysis of EMIR violations, and designing robust power grids for high-performance AI connectivity silicon.
Location: Tel Aviv-Yafo, Tel Aviv District, Israel
Company
develops semiconductor-based connectivity solutions and software for rack-scale AI infrastructure, including CXL, Ethernet, NVLink, PCIe, and UALink technologies.
What you will do
- Perform IR drop analysis and signal and power electromigration analysis for complex SoCs.
- Develop and execute backend power methodologies for advanced semiconductor chips.
- Collaborate with Physical Design engineers to ensure full power integrity.
- Partner with Package Design engineers on chip-package co-analysis.
- Identify root causes of voltage-drop violations and electromigration risks.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering or a related technical field.
- 7+ years of hands-on experience in EMIR or power integrity analysis for high-performance SoCs or high-speed connectivity products.
- Strong proficiency with industry-standard EMIR tools such as Ansys RedHawk, RedHawk-SC, or Cadence Voltus.
- Deep understanding of EM/IR challenges in advanced FinFET nodes, including 7nm, 5nm, and 3nm.
- Deep knowledge of place-and-route flows, power-grid synthesis, RC extraction, standard-cell architecture, and signal versus power-grid electromigration trade-offs.
Nice to have
- Familiarity with thermal analysis tools and their interaction with electrical performance.
- Experience with sign-off criteria and margins for high-volume production chips.
- Good understanding of timing and place-and-route flows.
- Basic understanding of packaging, top metal layers, MIM capacitor usage, and power distribution.
- Ability to write TCL scripts for STA and Fusion Compiler.
Culture & Benefits
- Opportunity to contribute technical ownership at a newly established strategic R&D center in Israel.
- Work on connectivity silicon supporting large-scale AI and cloud environments.
- Inclusive environment encouraging applications from people with diverse backgrounds and experiences.
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