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4 часа назад

Forward Deployment Engineering Manager (AI)

Формат работы
hybrid
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US/SK
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Forward Deployment Engineering Manager (AI): Building and leading a regional team of thermal and thermo-mechanical engineers that validates customer semiconductor and electronics designs using Vinci’s physics AI platform, with an accent on thermal management, warpage, stress, reliability, and customer deployment. Focus on guiding complex thermal and mechanical simulations, demonstrating software value through evaluations and proofs of concept, and translating customer feedback into product improvements.

Location: South Korea; remote role with on-site presence several days per week at customer sites in Seoul. Moderate travel within Asia and occasional intercontinental travel to collaborate with the US team may be required.

Company

hirify.global is a fast-moving startup developing Physics AI software for hardware design, semiconductor engineering, and physics simulation workflows.

What you will do

  • Build, lead, and scale a team of thermal and thermo-mechanical engineers, setting technical direction and mentoring team members.
  • Support customer evaluations by setting up simulations, running test cases, and interpreting results.
  • Collaborate with Sales on product demonstrations, proof-of-concept evaluations, and technical discussions.
  • Guide customer onboarding and deployments through technical support, training, and troubleshooting.
  • Translate customer pain points and workflow challenges into actionable feedback for Product and Engineering.
  • Deliver technical workshops and represent hirify.global at semiconductor conferences and industry events.

Requirements

  • Degree in Mechanical, Electrical, or a related engineering field.
  • 15+ years of hands-on experience in thermal management, mechanical warpage, stress, and reliability.
  • Experience with commercial simulation software such as Flowthem, Cadence, Ansys, Abaqus, or LS-DYNA.
  • Scripting experience with Python or C++.
  • Prior managerial or technical leadership experience and experience in customer-facing roles.
  • Strong problem-solving, communication, and interpersonal skills, including the ability to explain complex results to technical and business audiences.

Nice to have

  • Experience with semiconductor electronics packaging, advanced packaging, foundries, chip or wafer warpage, and 2.5D/3D ICs.
  • Experience in pre-sales, technical sales, or customer-facing engineering.
  • Experience commercializing EDA or simulation software for semiconductor and electronics companies.
  • Ability to learn physics-based workflows and AI-assisted design tools quickly.

Culture & Benefits

  • Work at the intersection of advanced AI, real-world engineering, and customer success.
  • Collaborate with engineers and researchers across Product, Engineering, and Sales.
  • Help define the future of AI-assisted hardware design.
  • Remote work with customer-site presence and regional travel requirements.

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