Head of Forward Deployment (AI)

Location: Must be based in Singapore, with moderate travel within Asia (Korea, Taiwan) and occasional travel to the US.

Compensation: SGD 1 – SGD 2

Company

hirify.global is a startup building Physics AI for hardware design, bridging the gap between traditional simulation and machine learning to redefine semiconductor design and verification.

What you will do

• Build, lead, and scale a high-performing team of thermal and thermo-mechanical engineers.
• Engage with customer engineering teams during the evaluation phase to demonstrate platform value.
• Collaborate with sales to deliver product demonstrations and conduct proof-of-concept evaluations.
• Provide technical guidance, training, and troubleshooting during customer onboarding and production deployments.
• Act as a key feedback channel to product and engineering teams to drive continuous improvement.
• Represent the company at industry conferences and semiconductor events.

Requirements

• Degree in Mechanical, Electrical, or related engineering field.
• 15+ years of hands-on experience in thermal management, mechanical warpage, stress, and reliability using commercial software (e.g., Ansys, Abaqus, LS Dyna).
• Scripting proficiency in Python or C++.
• Prior managerial or leadership experience.
• Experience in customer-facing roles.
• Must be based in Singapore and able to travel within Asia and to the US.

Nice to have

• Familiarity with semiconductor electronics packaging (2.5D/3D IC, chip/wafer warpage).
• Experience in pre-sales or technical sales for EDA or simulation tools.
• Ability to adapt to AI-assisted design workflows.

Culture & Benefits

• Work at the intersection of advanced AI, real-world engineering, and customer success.
• Collaborate with world-class engineers and researchers in a fast-moving startup environment.
• High-impact leadership role defining the future of AI in hardware design.