Thermal Engineer (AI Hardware)

Location: Dongtan or Seoul, South Korea; Dongtan is the primary and preferred work location

Company

hirify.global develops AI accelerator hardware, including NPU and ASIC-based products for data-center servers.

What you will do

• Define end-to-end thermal designs from NPU/ASIC packages and PCBs through PCIe, OAM, and SXM cards to server chassis.
• Select and design heatsinks, heat pipes, vapor chambers, cold plates, fans, and thermal interface materials.
• Evaluate air, liquid, two-phase, and immersion cooling approaches and run CFD simulations using FloTHERM and Icepak.
• Validate NPU card and system thermal performance through wind tunnel testing, thermocouples, RTDs, IR cameras, and multi-temperature recorders.
• Correlate simulations with measurements using design-of-experiments methods and support thermal cycling and burn-in reliability testing.
• Collaborate with electrical, mechanical, and manufacturing teams, negotiate thermal specifications with OEM/ODM and hyperscale customers, and prepare design guides, reference designs, and test reports.

Requirements

• Experience with GPU or NPU card development or data-center server development.
• Experience with thermal modeling, CFD, heat-transfer, and fluid-flow simulation.
• Experience designing active and passive cooling solutions, including heatsinks, fans, and liquid-cooling cold plates.
• Hands-on thermal testing experience using FLIR cameras, thermocouples, RTDs, or temperature recorders.
• Business-level English communication skills.
• Positive and proactive engineering approach.

Nice to have

• Experience with FloTHERM or Icepak.
• Knowledge of OCP OAM, PCIe CEM, NVIDIA SXM, or related hardware form-factor standards.
• Experience with EM-thermal co-simulation using power maps from HFSS, SIwave, or PowerDC.

Culture & Benefits

• Full-time position within the Hardware System HW department.
• Work location flexibility between Dongtan and Seoul, with preference for Dongtan.
• Cross-functional collaboration with electrical, mechanical, manufacturing, OEM/ODM, and hyperscale customer teams.