RD Scientist (AFM/SPM)

Location: Hsinchu City, Hsinchu County, Taiwan

Company

hirify.global develops materials and solutions for advanced electronics and high-tech industries.

What you will do

• Lead and execute surface and interface characterization projects using Atomic Force Microscopy and related Scanning Probe Microscopy techniques.
• Develop quantitative methods for nanoscale topography, mechanical, electrical, and surface-property characterization.
• Perform and interpret KPFM, EFM, QNM, LFM, and Conductive AFM measurements.
• Develop characterization workflows and data-analysis methods to connect material interfaces with process performance.
• Support technology-development programs involving advanced packaging, interconnect materials, and conductive adhesives.
• Collaborate with Reliability, Process Development, Materials R&D, and Failure Analysis teams, and communicate findings through reports, presentations, and technical reviews.

Requirements

• Ph.D. or M.S. in Materials Science, Physics, Chemistry, Nanotechnology, Electrical Engineering, or a related field.
• Hands-on experience operating AFM/SPM systems and a strong understanding of nanoscale surface and interface characterization.
• Demonstrated experience with one or more of KPFM, EFM, QNM, LFM, and Conductive AFM.
• Ability to independently design experiments, analyze data, and derive actionable conclusions.
• Strong analytical, problem-solving, collaboration, and communication skills.
• Excellent written and verbal communication skills in English are required.

Nice to have

• Experience with SIMS, XPS, AES, or other advanced surface-analysis techniques.
• Semiconductor or advanced packaging industry experience.
• Experience supporting failure-analysis investigations and addressing complex surface and interface characterization challenges.
• Experience characterizing nanoscale electrical, mechanical, and tribological properties using advanced AFM/SPM techniques.

Culture & Benefits

• Full-time employment.
• Collaborative work across multidisciplinary R&D, Reliability, Process Development, and Failure Analysis teams.
• Comprehensive pay and benefits package.
• Equal-opportunity workplace with reasonable accommodation available during the application process.