Senior OSAT Engineer (Advanced Packaging)

Location: Virtual Taiwan; Shift 1 (Taiwan)

Company

hirify.global develops FPGA and SoC products supported by advanced semiconductor packaging and outsourced assembly and test manufacturing.

What you will do

• Drive outsourced assembly and test engineering activities across a global supplier network.
• Own sourcing strategies for advanced substrates, including FCBGA and high-density interconnects, and leading-edge OSAT technologies.
• Lead value-engineering initiatives focused on packaging design rules, substrate layer counts, materials, and manufacturing steps.
• Build bottom-up should-cost models for bumping, wafer-level packaging, assembly, and final test.
• Align technical roadmaps with hardware architecture teams and silicon foundries for 2.5D/3D, chiplet, and co-packaged optics technologies.
• Manage Tier-1 OSAT and substrate supplier relationships while improving yield, pricing, capacity, and supply-chain resilience.

Requirements

• Master’s degree in Engineering or an MBA.
• 10+ years of experience in advanced packaging, including flip chip, wafer-level packaging, 2.5D/3D ICs, and silicon interposers.
• Deep experience with high-density substrate manufacturing and semiconductor backend engineering.
• Proven record of structural cost reductions through teardowns, alternative materials, manufacturing optimization, or design-for-cost practices.
• 10+ years of high-tech supply-chain experience negotiating master services agreements and capacity reservation agreements with global OSATs.
• Advanced financial modeling, semiconductor cost accounting, and data-driven supplier scorecard management skills.

Culture & Benefits

• Full-time regular employment.
• Cross-functional collaboration with OSAT partners, substrate suppliers, hardware architecture teams, and silicon foundries.
• Focus on resilient supply chains, multi-sourcing critical components, and risk mitigation during new product introduction.