15 часов назад
Director of Field Applications Engineering (Europe and APAC)
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Director of Field Applications Engineering (Europe and APAC) (Semiconductor Silicon IP): Leading and expanding a distributed FAE team while driving technical adoption, customer integration, and design wins for fabric interconnect silicon IP with an accent on pre-sales and post-sales engineering, customer evaluations, and regional team development. Focus on managing critical technical escalations, guiding NoC and SoC architecture reviews, influencing the IP roadmap, and enabling semiconductor ecosystems across Europe and APAC.
Location: Remote, based in the EU or the UK; coverage across Europe and APAC; up to 30–40% international travel required.
Company
is a fast-moving Series B startup developing and licensing software-driven unified fabric solutions and silicon IP for single-die and multi-die systems.
What you will do
- Lead, grow, recruit, and mentor a distributed team of senior Field Applications Engineers across Europe and APAC.
- Partner with regional sales directors to drive technical adoption and high-value design wins.
- Own customer-facing pre-sales and post-sales support, including escalations, proof-of-concepts, evaluations, and architectural reviews.
- Deliver technical keynotes, deep dives, product demonstrations, application notes, whitepapers, and training collateral.
- Feed regional customer requirements and market insights into R&D, Product Management, and the fabric interconnect IP roadmap.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
- At least 5 years managing customer-facing engineering teams and at least 10 years in semiconductor, silicon IP, or high-performance networking.
- Deep knowledge of Network-on-Chip, AMBA protocols including CHI, AXI, and ACE, or PCIe/CXL fabrics.
- Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools such as Synopsys, Cadence, and Siemens.
- Experience with AI/ML accelerators, data center architectures, automotive SoC requirements, and cross-cultural teams and clients in Europe and Asia.
- Exceptional English verbal and written communication skills; the role requires being based in the EU or UK.
Nice to have
- Master’s degree or PhD in Electrical or Computer Engineering.
- Experience in a fast-growing, venture-backed silicon IP startup.
- Technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
- Mandarin, Japanese, Korean, or German language skills.
Culture & Benefits
- Fast-paced, early-stage startup environment with a high degree of autonomy.
- Performance incentives and equity.
- Comprehensive medical, dental, and vision benefits.
- 401(k) retirement plan.
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