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13 часов назад

Principal Physical Design Engineer (RTL-to-GDSII)

Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
India
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Principal Physical Design Engineer (RTL-to-GDSII) (Sub-5nm semiconductor design): Transforming raw RTL into production-ready GDSII for high-speed AI blocks and SoCs with an accent on PPA optimization, advanced-node implementation, and sign-off quality. Focus on building scalable Cadence-based flows, eliminating runtime and convergence bottlenecks, and shaping architecture through early physical-design collaboration.

Location: Bangalore, hybrid

Company

hirify.global develops advanced AI hardware and software systems for edge-to-cloud computing, based on in-memory computing technology for power-, energy-, and space-constrained applications.

What you will do

  • Lead full-flow implementation of large, high-speed blocks and SoCs from synthesis through sign-off using the Cadence Digital Suite.
  • Optimize power, performance, and area by analyzing library cells, metal stacks, PDK constraints, and EDA tool engines.
  • Build and refine robust, repeatable push-button execution methodologies that minimize manual iterations.
  • Collaborate with RTL, architecture, and DFT teams to bring physical constraints into early design decisions.
  • Identify runtime, convergence, and tool limitations and develop automated solutions to remove execution bottlenecks.
  • Mentor the physical design team and work with front-end, foundry, and EDA vendor partners.

Requirements

  • 14+ years of physical design experience with multiple sub-5nm tape-outs.
  • Mastery of Cadence Innovus, Tempus, Joules, Pegasus, and Voltus.
  • Deep knowledge of sub-5nm physics, including EUV constraints, multi-patterning, FinFET, and IR/EM challenges.
  • Expertise in static timing analysis, physical verification, power integrity, and ECO methodology.
  • Proficiency in Tcl and Python for custom flow wrappers and PPA data-mining tools.
  • Ability to apply first-principles thinking, influence architecture and RTL decisions, and build strong technical relationships across teams.

Culture & Benefits

  • Autonomy to overhaul legacy physical design flows.
  • Opportunity to work on cutting-edge 3nm and 2nm semiconductor nodes.
  • Focus on first-principles engineering rather than blindly following vendor best practices.
  • Resources to develop scalable and predictable silicon implementation methodologies.

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