Engineer I - Process (Ball Attach)

Location: Philippines - Mphil 3

Employment type: Full time

Company

hirify.global is a global semiconductor technology company developing and manufacturing products and solutions that power electronic systems.

What you will do

• Lead and support the start-up of ball attach lines and new products, including initial process conditions and mass-production readiness validation.
• Monitor ramp-up performance and stabilize processes while mitigating risks to yield, quality, and throughput.
• Develop, maintain, optimize, standardize, and release ball attach recipes covering EFO settings, bonding force, ultrasonic power, time, and temperature profiles.
• Perform DOE, process audits, line checks, and analysis of yield trends and defects such as missing balls, bridging, and deformation.
• Conduct root cause analysis using 5 Whys, Fishbone, and 8D methods, and implement corrective and preventive actions.
• Collaborate with Equipment, Quality, and Production teams on process issues, improvement projects, cost reduction, documentation, and customer audits.

Requirements

• Bachelor’s degree in Electronics, Industrial, Mechanical, Chemical Engineering, or an equivalent discipline.
• At least 3 years of semiconductor experience focused on WLCSP or BGA processes.
• Experience with Ball Attach, Ball Repair, Reflow, Flux Rinse, and Shear processes.
• Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and structured problem-solving methodologies.
• Strong analytical, troubleshooting, communication, teamwork, leadership, mentoring, and documentation skills.
• Knowledge of safety protocols, cleanroom practices, MS Office, and maintenance management systems.

Nice to have

• Strong experience with WLCSP or advanced packaging tools.

Culture & Benefits

• Opportunity to work within a large global semiconductor organization.
• Values-based culture emphasizing trust, empowerment, respect, diversity, communication, and community.
• Employee development and career-growth programs.
• Travel requirement of 0%–25%.