Process Engineer - Underfill Process (UF)

Location: Batu Kawan, Malaysia; onsite at the Penang SDSM Office in Seberang Perai

Company

hirify.global develops Flash memory and advanced storage solutions supported by large-scale semiconductor manufacturing and advanced 4IR production capabilities.

What you will do

• Own the Underfill process for flip-chip die-level assembly and support assembly process engineering solutions.
• Set up new Underfill processes, materials, recipes, process windows, DOE studies, and golden recipes for package qualifications.
• Lead process, material, equipment, tool, and new product qualifications against CTQ, CPK, yield, UPH, quality, risk, and cost objectives.
• Maintain assembly yield and test yield, investigate process deviations, and improve cycle time, process capability, and production performance.
• Perform root cause analysis using 5M+1E, 5 Whys, DMAIC, and 8D, while coordinating equipment troubleshooting and preventive maintenance.
• Collaborate with Quality, Manufacturing, Product Engineering, Equipment Engineering, Packaging Engineering, and suppliers; maintain documentation and provide technical training.

Requirements

• Bachelor’s degree or higher in Engineering, Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or a related field.
• Minimum 4–5 years of semiconductor assembly process engineering experience.
• Experience developing and sustaining Underfill processes and working with flip-chip die-level assembly technology.
• Hands-on experience supporting production, yield improvement, quality improvement, process qualification, and equipment troubleshooting.
• Working knowledge of FMEA, SPC, 8D, Six Sigma, DOE, Minitab, and JMP.
• Strong analytical, communication, project execution, documentation, teamwork, coaching, and continuous improvement skills.

Nice to have

• Experience with Nordson dispensers, Heller reflow ovens, C-Scan, SEM, SAM, X-ray, and cross-section analysis.
• Knowledge of Underfill defects including voiding, fillet irregularities, incomplete fill, delamination, overflow, and package warpage.
• Experience with NPI, high-volume manufacturing, process transfer, manufacturing ramp-up, and reliability qualifications such as MSL, TCT, HTS, HAST, and board-level testing.

Culture & Benefits

• Full-time exempt position.
• Inclusive environment focused on diversity, belonging, respect, and contribution.
• Accommodation support is available during the application and hiring process for candidates with disabilities.