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16 часов назад

Senior Process Engineer (Die Prep)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Malaysia
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Process Engineer (Die Prep) (Semiconductor Manufacturing): Developing, sustaining, optimizing, and troubleshooting semiconductor manufacturing processes with an accent on yield, quality, productivity, and process stability. Focus on structured root cause investigations, defect reduction, process control, and implementing corrective actions across manufacturing and engineering teams.

Location: Batu Kawan, Malaysia. Work location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office. Onsite full-time position.

Company

hirify.global develops Flash and advanced memory technologies supported by large-scale manufacturing capabilities and a global supply chain.

What you will do

  • Own and support assigned semiconductor manufacturing processes while providing daily technical support to production.
  • Monitor process performance, yield, quality, productivity, and stability metrics.
  • Lead yield improvement, defect reduction, excursion investigation, and recurrence-prevention activities.
  • Conduct root cause investigations using 5 Why, 8D, DMAIC, FMEA, and SPC/APC analysis.
  • Implement corrective and preventive actions, process changes, qualifications, and continuous improvement initiatives.
  • Improve cost, capacity, equipment utilization, throughput, and manufacturing efficiency in collaboration with Manufacturing, Quality, Equipment Engineering, Failure Analysis, Production, and NPI teams.

Requirements

  • Bachelor’s degree in Mechanical, Electrical, Electronics, Manufacturing, Materials Engineering, or an equivalent field.
  • 5–8 years of experience in semiconductor manufacturing or process engineering.
  • Strong knowledge of process control, SPC, FMEA, DOE, statistical analysis, yield enhancement, defect reduction, and productivity improvement.
  • Experience with structured problem-solving methods including 8D, 5 Why, Fishbone, and DMAIC.
  • Understanding of quality systems and manufacturing standards, with the ability to lead projects and drive corrective actions to closure.
  • Strong technical communication, documentation, data analysis, and cross-functional collaboration skills.

Nice to have

  • Experience in semiconductor backend assembly, die preparation, die attach, wire bonding, molding, singulation, AOI, testing, or related processes.
  • Experience with automation, machine learning applications, APC, Industry 4.0, or digital transformation projects.
  • Knowledge of reliability testing, failure analysis, SAP, MES, JMP, Minitab, Power BI, or Tableau.
  • Experience leading engineering teams or mentoring junior engineers.
  • Six Sigma Green Belt or Black Belt certification.

Culture & Benefits

  • Exempt full-time employment position with compensation and benefits provided according to the role and location.
  • Inclusive environment focused on diversity, belonging, respect, and contribution.
  • Accommodation support is available during the application and hiring process for applicants with disabilities.

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