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7 часов Π½Π°Π·Π°Π΄

Hardware Technical Program Manager (AI/ML)

200Β 000 - 240Β 000$
Π’ΠΈΠΏ Ρ€Π°Π±ΠΎΡ‚Ρ‹
fulltime
Π“Ρ€Π΅ΠΉΠ΄
senior
Английский
b2
Π‘Ρ‚Ρ€Π°Π½Π°
US
Вакансия ΠΈΠ· списка Hirify.GlobalВакансия ΠΈΠ· Hirify Global, списка ΠΌΠ΅ΠΆΠ΄ΡƒΠ½Π°Ρ€ΠΎΠ΄Π½Ρ‹Ρ… tech-ΠΊΠΎΠΌΠΏΠ°Π½ΠΈΠΉ
Для мэтча ΠΈ ΠΎΡ‚ΠΊΠ»ΠΈΠΊΠ° Π½ΡƒΠΆΠ΅Π½ Plus

ΠœΡΡ‚Ρ‡ & Π‘ΠΎΠΏΡ€ΠΎΠ²ΠΎΠ΄

Для мэтча с этой вакансиСй Π½ΡƒΠΆΠ΅Π½ Plus

ОписаниС вакансии

ВСкст:
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TL;DR
Hardware Technical Program Manager (AI/ML): Owns end-to-end silicon programs from architecture freeze through RTL, verification, physical implementation, tapeout, bring-up, and production release with an accent on cross-functional execution, schedule control, and semiconductor signoff. Focus on managing critical dependencies across IP, PDKs, EDA, emulation, foundry and OSAT partners, while driving risk mitigation, PPA and schedule tradeoffs, and executive reporting.

Location: San Jose, CA, Pittsburgh, PA, or Austin, TX

Salary: $200,000–$240,000 per year, plus bonus and equity.

Company

hirify.global develops energy-efficient general-purpose processors for continuous AI/ML computing in IoT devices and other edge applications.

What you will do

  • Own silicon programs from architecture freeze through RTL, verification, physical implementation, tapeout, silicon bring-up, and production release.
  • Build and maintain execution schedules, critical paths, dependencies, status reporting, and decision records.
  • Coordinate architecture, RTL, DV/emulation, DFT, physical design, IP, package, firmware, software, and supply-chain handoffs.
  • Drive tapeout readiness and closure of timing, power, IR/EM, DRC/LVS, DFT coverage, ECO, and GDS handoff requirements.
  • Manage silicon arrival, ATE/loadboard readiness, lab scheduling, bug triage, and ECO or respin decisions.
  • Coordinate foundry, OSAT, IP, and EDA partners while tracking resources, budgets, escalations, and executive decisions.

Requirements

  • B.S. in Electrical or Computer Engineering, Computer Science, or an equivalent field.
  • 7+ years of semiconductor, hardware engineering, or program management experience, including at least two complete SoC/ASIC programs through tapeout and silicon bring-up.
  • Working fluency in RTL, functional verification, coverage closure, DFT, synthesis, PnR, STA, physical signoff, GDSII handoff, and post-silicon validation.
  • Experience building bottoms-up schedules, analyzing critical paths, mapping dependencies, and influencing technical stakeholders without direct authority.
  • Strong written and verbal communication skills, including communication with principal engineers and executive audiences.
  • Hands-on experience with Jira, Confluence, MS Project or Smartsheet, plus familiarity with Synopsys, Cadence, and Siemens EDA tools.

Nice to have

  • Prior hands-on engineering experience in design, DV, or physical design.
  • Experience with advanced or FinFET nodes, direct foundry engagement, and TSMC.
  • Experience with AI/ML accelerators, dataflow or novel compute architectures, emulation or FPGA prototyping, and pre-silicon software enablement.
  • Exposure to package and board co-design, OSAT coordination, EVK/reference board programs, and customer or FAE enablement.
  • Familiarity with automotive, industrial, or security quality and compliance frameworks.

Culture & Benefits

  • 401(k) match and company-paid benefits.
  • Equity program and bonus opportunity.
  • Paid parental leave.
  • Flexible work practices and support for personal and professional development.

Π‘ΡƒΠ΄ΡŒΡ‚Π΅ остороТны: Ссли Ρ€Π°Π±ΠΎΡ‚ΠΎΠ΄Π°Ρ‚Π΅Π»ΡŒ просит Π²ΠΎΠΉΡ‚ΠΈ Π² ΠΈΡ… систСму, ΠΈΡΠΏΠΎΠ»ΡŒΠ·ΡƒΡ iCloud/Google, ΠΏΡ€ΠΈΡΠ»Π°Ρ‚ΡŒ ΠΊΠΎΠ΄/ΠΏΠ°Ρ€ΠΎΠ»ΡŒ, Π·Π°ΠΏΡƒΡΡ‚ΠΈΡ‚ΡŒ ΠΊΠΎΠ΄/ПО, Π½Π΅ Π΄Π΅Π»Π°ΠΉΡ‚Π΅ этого - это мошСнники. ΠžΠ±ΡΠ·Π°Ρ‚Π΅Π»ΡŒΠ½ΠΎ ΠΆΠΌΠΈΡ‚Π΅ "ΠŸΠΎΠΆΠ°Π»ΠΎΠ²Π°Ρ‚ΡŒΡΡ" ΠΈΠ»ΠΈ ΠΏΠΈΡˆΠΈΡ‚Π΅ Π² ΠΏΠΎΠ΄Π΄Π΅Ρ€ΠΆΠΊΡƒ. ΠŸΠΎΠ΄Ρ€ΠΎΠ±Π½Π΅Π΅ Π² Π³Π°ΠΉΠ΄Π΅ β†’