1 день назад
Advanced Packaging Inspection (Mantis-D) Process Support Engineer (Semiconductor)
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Advanced Packaging Inspection (Mantis-D) Process Support Engineer (Semiconductor): Leading customer deployment and qualification of Mantis-D integrated module inspection systems for HBM, 2.5D/3D packaging, hybrid bonding, and next-generation package integration with an accent on optical inspection, machine vision, AI-based defect classification, and yield improvement. Focus on developing inspection methodologies, optimizing recipes, analyzing manufacturing data, and solving complex customer process and production-ramp challenges.
Location: Hwaseong, South Korea. International travel required at 20–30%. Relocation is not available.
Company
develops materials science and engineering solutions and equipment for semiconductor and advanced display manufacturing.
What you will do
- Develop expertise in advanced semiconductor packaging processes, customer manufacturing flows, inspection challenges, technology gaps, and yield improvement opportunities.
- Serve as technical lead for Kinex Mantis-D integrated module inspection systems used for HBM, 2.5D/3D packaging, hybrid bonding, and next-generation package integration.
- Lead customer evaluations, demonstrations, beta-site activities, process qualifications, proof-of-concept projects, and production ramp activities.
- Define inspection requirements, optimize recipes, establish acceptance criteria, and create application deployment and process qualification plans.
- Develop inspection methodologies using macro optical inspection, machine vision, AI-based defect classification, and integrated inspection solutions.
- Analyze technical and manufacturing data, perform root-cause analysis, transfer application capabilities to regional teams, and contribute to product roadmap development.
Requirements
- 6+ years of experience in semiconductor manufacturing, inspection, metrology, yield engineering, or advanced packaging.
- Strong knowledge of HBM, hybrid bonding, chiplet integration, wafer-level packaging, and advanced substrate technologies.
- Hands-on experience with optical inspection systems, machine vision, defect inspection methodologies, or process control solutions.
- Experience leading customer-facing technical projects, evaluations, and production qualifications.
- Strong project management, technical leadership, problem-solving, presentation, and customer engagement skills.
- Excellent English communication and presentation skills required.
Culture & Benefits
- Supportive environment focused on learning, professional development, and career growth.
- Health and wellbeing programs and employee support.
- Regular employment with full-time status.
- Work with global product engineering, marketing, software, hardware, R&D, and customer organizations.
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