Principal Electrical Engineer (NDT)

Location: Rochester, NY, US; primarily a traditional office environment

Salary: $140,000–$170,000 annually

Company

Provides medical imaging systems, non-destructive testing X-ray systems, and contract manufacturing solutions.

What you will do

• Lead the end-to-end design, development, testing, and commercialization of electrical subsystems for digital radiographic equipment.
• Design analog and digital circuits, schematics, PCB layouts, battery systems, and conventional or flexible wiring harnesses.
• Perform board bring-up, validation, debugging, root cause analysis, and corrective actions for development and released products.
• Integrate embedded systems with firmware and software engineering teams, including contribution to system architecture and imaging data paths.
• Support manufacturing, suppliers, procurement, DFM/DFT activities, first articles, component obsolescence mitigation, and production issue resolution.
• Create requirements, specifications, drawings, bills of materials, and other traceable design documentation.

Requirements

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related STEM field.
• At least 10 years of hands-on electrical engineering experience and technical leadership of electrical systems across 3–5 products from concept through production.
• End-to-end circuit board design experience, including schematic capture, PCB layout, cabling, harnessing, component selection, documentation, verification, validation, and production release.
• Strong knowledge of embedded microprocessor design and integration, including ARM cores and DDR memory interfaces.
• Experience executing subsystem and system-level test plans with oscilloscopes, logic analyzers, and other laboratory equipment.
• Practical prototyping experience with PCB fabrication and assembly, wiring harnesses, and test fixtures; working knowledge of Microsoft Visio for electrical drawings.

Nice to have

• NDT product experience and knowledge of radiography or fluoroscopy systems.
• Mixed-signal, low-noise, imaging, or sensor electronics experience.
• Experience with wireless technologies, firmware development in C/C++, or FPGA design using VHDL/Verilog.
• Knowledge of IEC 60601-2-54 and IEC 60601-2-43 safety standards.
• Practical soldering and rework skills down to 0402 package size.

Culture & Benefits

• Work in an R&D environment focused on medical imaging and non-destructive testing products.
• Collaborate with mechanical, firmware, manufacturing, supplier, and procurement partners.
• Standard office environment with controlled temperature and humidity, moderate to light noise, and standing desks available.
• Equal opportunity employment and reasonable accommodations during the application process.

Hiring process

• Complete the online application process.
• Request reasonable accommodations if needed to participate in the application process.