EMIB-T Substrate Yield Lead

Location: On-site in Phoenix, Arizona, United States

Annual salary: $180,770–$255,200 USD

Company

hirify.global develops and manufactures semiconductor technologies and advanced packaging platforms.

What you will do

• Own end-to-end substrate yield performance for EMIB-T technology development and manufacturing readiness.
• Drive DFM/DFY engagement, defect pareto closure, process optimization, and yield improvement plans.
• Lead daily yield huddles and cross-functional reviews, identifying and addressing yield risks.
• Resolve critical yield, reliability, process, and supplier issues while tracking accountability and milestones.
• Partner with substrate suppliers, engineering, manufacturing, design, quality, reliability, and platform integration organizations.
• Define and scale dashboards, automated analytics, computer vision, AI/ML defect detection, and automated defect classification for EMIB-T.

Requirements

• Master’s degree with 6+ years of experience or PhD with 4+ years in engineering, materials science, physics, chemistry, data science, or a related technical discipline.
• At least 5 years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, or process engineering.
• Hands-on experience with statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and high-volume manufacturing execution.
• Strong analytical, problem-solving, stakeholder-influence, and complex issue-management skills.
• Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification.
• On-site presence in Phoenix, Arizona, United States is required.

Nice to have

• Experience working with substrate suppliers and external manufacturing partners.
• Program leadership experience coordinating cross-functional technical teams.
• Experience with EMIB, EMIB-T, TSV, 2.5D/3D integration, substrates, or heterogeneous integration.
• Experience supporting technology development, qualification, and manufacturing ramp of advanced semiconductor technologies.

Culture & Benefits

• Competitive total compensation with stock bonuses.
• Health, retirement, and vacation benefits.
• High-visibility work supporting advanced packaging technology across hirify.global Foundry Services and hirify.global Product Groups.
• Responsible Business Alliance compliance and ethical hiring practices.