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7 часов назад

Lead Product Marketing Manager (Semiconductor)

171 000 - 218 000$
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Lead Product Marketing Manager (Semiconductor): Developing business, product, and marketing plans for laser anneal platforms with an accent on product positioning, market penetration, and semiconductor customer needs. Focus on shaping product roadmaps, driving competitive analysis, launching and enhancing semiconductor capital equipment, and increasing adoption, revenue, and market share.

Location: San Jose, California, United States; travel within the US and other locations up to 20% of the time

Salary: $171,000–$218,000 annually, plus bonus opportunity

Company

hirify.global designs, develops, manufactures, and services advanced equipment used by semiconductor and technology companies to produce devices for computing, communications, AI, and other digital applications.

What you will do

  • Develop business, product, and marketing plans for laser anneal platforms.
  • Define market penetration strategies, product positioning, pricing scenarios, and competitive advantage initiatives.
  • Collaborate with engineering, manufacturing, sales, applications, service, and advanced technology teams on new products, product enhancements, and roadmaps.
  • Analyze customer device roadmaps and environments to support business strategies and communicate market needs.
  • Drive competitive analysis, continuous improvement feature adoption, and product differentiation.
  • Support product releases and communicate product value to customers, senior management, and sales channels throughout the product life cycle.

Requirements

  • BS degree in Physics or Engineering with at least 12 years of related experience; alternatively, an MS with 8 years or a PhD with 5 years of experience.
  • Experience with Tier 1 semiconductor customers.
  • Demonstrated success positioning and launching semiconductor capital equipment products.
  • Knowledge of semiconductor devices and module process integration in logic and/or memory fabrication is preferred.
  • Ability to influence cross-functional teams without formal authority and communicate effectively in writing and verbally.
  • Ability to travel within the US and other locations up to 20% of the time.

Nice to have

  • Experience with Rapid Thermal Processing, implant, or diffusion processes.
  • Knowledge of semiconductor device and module process integration.

Culture & Benefits

  • Entrepreneurial culture supporting new product development.
  • Medical, dental, and vision coverage.
  • 401(k) with company match, ESPP, flexible spending accounts, and commuter benefits.
  • Holiday, vacation, sick time, disability, life, and accident insurance.
  • Tuition reimbursement, employee assistance, identity theft remediation, and emergency travel assistance.

Hiring process

  • Multiple interviews with several team members, conducted in person or virtually.
  • References or a background investigation may be conducted before an offer.

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