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1 день назад

Product Marketing Manager V (Semiconductor Advanced Packaging)

174 000 - 239 500$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Product Marketing Manager V (Semiconductor Advanced Packaging): Developing and executing business and product marketing strategies for semiconductor advanced packaging, heterogeneous integration, and backend lithography technologies with an accent on market positioning, competitive intelligence, and product lifecycle management. Focus on evaluating new product investments, shaping pricing and technology roadmaps, and solving complex market and customer challenges across the semiconductor ecosystem.

Location: Santa Clara, California, United States. Relocation eligible. Travel required 20% of the time.

Salary: $174,000–$239,500 per year, with potential bonus and stock award compensation.

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductor chips and advanced displays.

What you will do

  • Develop and execute business and product marketing strategies for semiconductor advanced packaging, heterogeneous integration, backend lithography, and related technologies.
  • Drive market penetration, product positioning, revenue growth, competitive advantage, and market share expansion.
  • Lead competitive intelligence, market analysis, and Red Team assessments to identify risks, opportunities, and differentiation strategies.
  • Evaluate investment opportunities for new product development based on market trends and customer needs.
  • Support pricing strategy and partner with Engineering, Manufacturing, Sales, field teams, and key stakeholders on product launches and customer engagement.
  • Manage products across the full lifecycle and translate market requirements into product and technology roadmaps.

Requirements

  • Deep expertise in the relevant product marketing or semiconductor technology discipline.
  • Broad knowledge of related functional disciplines and the semiconductor advanced packaging ecosystem.
  • Ability to anticipate business and regulatory issues and recommend product, process, or service improvements.
  • Experience leading complex, high-risk projects and developing execution strategies.
  • Ability to solve unique, complex problems through conceptual and innovative thinking.
  • Strong communication and persuasion skills, including presenting complex ideas to senior stakeholders.

Culture & Benefits

  • Supportive work culture focused on learning, development, and career growth.
  • Comprehensive employee benefits supporting health and wellbeing.
  • Regular collaboration across engineering, manufacturing, sales, and field teams.
  • Regular employment with eligibility for additional compensation programs, as applicable.

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