8 часов назад
Senior Density Fill Development Engineer (Semiconductor)
128 880 - 245 160$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Density Fill Development Engineer (Semiconductor): Developing and deploying density fill components, physical verification rule decks, and EDA methodologies for Intel process design kits with an accent on manufacturability, advanced process technologies, and production validation. Focus on designing algorithmic solutions with Calibre, ICV, and Pegasus, debugging SVRF/TVF/PXL/PVL/PVTCL rule decks, and automating workflows for semiconductor design teams.
Location: Hybrid work model with on-site and off-site work at an assigned site in the United States; primary location Hillsboro, Oregon, with additional locations in Phoenix, Arizona; Santa Clara, California; and Austin, Texas.
Salary: $128,880–$245,160 annual USD
Company
develops semiconductor technologies, hardware products, and design automation solutions.
What you will do
- Design, develop, test, and debug density fill components for process design kits.
- Develop algorithmic solutions with Calibre, ICV, and Pegasus to address density deficiencies and manufacturability requirements.
- Collaborate with process developers, design rule owners, end users, and external EDA vendors to define requirements and implement tool features.
- Automate workflows and develop test systems to improve efficiency, accuracy, deployment, and integration with design methodologies.
- Advance EDA tools and methodologies for evolving semiconductor process technologies.
- Maintain documentation, training materials, and user guides for customers and design teams.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 8+ years of experience; alternatively, a master’s degree with 5+ years or a PhD with 2+ years.
- At least 5 years of hands-on experience with Calibre, ICV, or Pegasus, including methodology development, rule-deck debugging, or production deployment.
- At least 3 years of experience developing, maintaining, or debugging physical verification rule decks using SVRF, TVF, PXL, PVL, or PVTCL.
- Strong understanding of semiconductor device physics, process technology, design rules, and advanced-node physical design challenges.
- Strong knowledge of Unix/Linux platforms and computing environments.
- Ability to work in a hybrid model with on-site work at an assigned location in the United States.
Nice to have
- 5+ years of experience with density fill methodologies for semiconductor technologies at 16nm and below.
- Experience with advanced physical verification, DRC, density, and fill modules.
- Experience with foundry technologies, advanced packaging organizations, IDMs, or EDA vendors.
- Familiarity with Cadence Virtuoso or Synopsys Custom Designer.
- Leadership experience in innovation, process improvement, or cross-functional initiatives.
Culture & Benefits
- Hybrid work model combining on-site and off-site work.
- Competitive pay and stock bonuses.
- Health, retirement, and vacation benefits.
- Cross-functional collaboration with internal teams and external EDA vendors.
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